Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SGM2036-1.8YUDH4G/TR是由著名的电源管理芯片制造商SGMICRO(圣邦微)推出的一款高效电源IC,专为满足低功耗应用领域的需求而设计。该电源IC以其小巧的UTDFN-1×1-4L封装、稳定的输出电压@1.8V以及最大300mA的输出电流能力,成为了众多电子产品中不可或缺的关键组件。
SGM2036的额定输出电压为1.8V,适用于需要固定电压供电的广泛应用场景。300mA的输出电流也使其成为驱动如传感器、RF模块、低功耗微控制器等设备的理想选择。得益于其先进的电源管理设计,SGM2036在满足性能需求的同时,能够实现出色的能效,从而延长电池供电设备的使用寿命。
SGM2036采用UTDFN-1×1-4L小型封装,体积仅为1mm x 1mm,非常适合空间有限的设备。这一封装设计使得SGM2036能够在嵌入式系统、便携式电子产品和各种智能设备中得以应用,尤其是在对空间布局有严格要求的设计中,显示出其独特的优势。此外,该产品的引脚间距和布局设计也有助于简化PCB设计,提高生产效率。
由于其优良的电源管理性能,SGM2036-1.8YUDH4G/TR广泛应用于各类便携设备,如:
SGM2036的设计提供了多项保护特性,包括过流保护、过压保护和短路保护等,大大增强了系统的可靠性。这种保护机制对产品的长期稳定运行至关重要,尤其是在多变的负载条件下。
此外,SGM2036支持宽输入电压范围,使设计仍然具备良好的灵活性,能够适应不同的电池技术及电源管理需求。
总体而言,SGM2036-1.8YUDH4G/TR是一款性能优越、应用广泛的电源IC。其300mA输出电流、稳定的1.8V供电、高效能,以及小巧的UTDFN-1×1-4L封装使其在现代电子系统中扮演着至关重要的角色。无论是开发新产品,还是对现有产品进行升级,这款电源IC都能够为设计师提供强大的支持与便利,是高效电源解决方案的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products