Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SGMICRO(圣邦微)是一家专注于高性能模拟和混合信号集成电路(IC)的国际知名企业,致力于为消费者和工业电子产品提供高稳定性、高集成度的解决方案。公司的产品涵盖了电源管理、信号处理、传感器接口等多个领域,广泛应用于移动设备、计算机、家电、汽车电子及物联网等领域。
SGM2036-1.1YUDH4G/TR是一款高性能、低功耗的LDO(低压差线性稳压器),采用UTDFN-1×1-4L封装形式,适用于各种便携式电子设备中的电源管理应用。此器件的主要功能是将不稳定的输入电压转换为恒定稳定的输出电压,以满足下游电路对于电压稳定性的需求。
输入电压范围广:SGM2036具有较宽的输入电压范围(2.3V至5.5V),可以适应多种不同应用场景中的电源条件。
低压差输出:该器件的低压差特性使其在提供稳定输出电压的同时,能够高效工作,减少能量损耗。具体来说,SGM2036在输出电流为150mA时的典型压降小于300mV,适合于电池驱动的应用场合。
固定输出电压:SGM2036-1.1YUDH4G/TR提供固定输出电压为1.1V,能够满足大多数低电压应用需求,例如数字电路和消费类电子设备。
高稳定性与低噪声:该器件具有优秀的负载瞬态响应与低输出噪声表现,使得其在敏感设备中表现出色,同时有效降低电源供电带来的干扰。
宽温度范围:SGM2036适应的工作温度范围为-40°C至+125°C,确保其在极端工作环境下的可靠性。
超小封装:采用UTDFN-1×1-4L封装,尺寸仅为1mm x 1mm,极大地节省了板级空间,非常适合于空间受限的电子设计。
SGM2036-1.1YUDH4G/TR可广泛应用于各种580mA以下的低功耗设备,例如:
在设计中使用SGM2036时,需要考虑以下几个方面:
SGM2036-1.1YUDH4G/TR是圣邦微推出的一款性能卓越的LDO线性稳压器,凭借其广泛的输入范围、低压差特性以及超小封装设计,成为市场上极具竞争力的电源管理解决方案之一。适合多种低功耗应用,特别是在空间受限和需要高稳定性输出的场合,SGM2036展现出其卓越的性能与可靠性。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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