WMSIC Electronic Components

SGMICRO SGM2225-5.0XKC3G/TR SGM2225

ModelSGM2225-5.0XKC3G/TR
PackageSOT-223-3
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2225-5.0XKC3G / TR
Type
SGMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
850mV@(800mA)
Electronic Component
SGMICRO
Electronic Component
SGM2225-5.0XKC3G/TR
Electronic Component
1
Package
SOT-223-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.372g
Electronic Component
1
Features
Terminal Block; Output
Electronic Component
BM0206756800
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
36V
Output
Electronic Component
Output Voltage
5V
Output Current
800mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2225-5.0XKC3G/TR 产品概述

一、产品简介

SGM2225-5.0XKC3G/TR 是由圣邦微(SGMICRO)推出的一款高性能线性电源集成电路(IC),能够提供稳定的 5V 电压输出,输出电流可达 800mA。这款电源IC采用了小型 SOT-223-3 封装,适合集成到空间有限的电子产品中,为各种便携式设备和嵌入式系统提供了理想的电源解决方案。

二、主要特点

  1. 高输出电流: SGM2225 具有高达 800mA 的输出能力,可以满足大多数小型电子设备的电源需求。
  2. 稳压输出: IC 输出电压稳定在 5V,适用于需要维持恒定电压条件的电路设计。
  3. 低功耗设计: SGM2225 采用的先进技术确保了低静态电流和高效率,减少了在待机模式下的能量损耗。
  4. 小型封装: SOT-223-3 封装使得该产品具备小巧的体积,方便在空间受限的应用中使用。
  5. 宽输入电压范围: IC 支持广泛的输入电压范围,能够适配多种电源供电条件。
  6. 保护功能: 具备过流保护(OCP)和过热保护(OTP)机制,确保了电路的安全性和稳定性。

三、应用领域

SGM2225-5.0XKC3G/TR 电源IC 的应用范围十分广泛,适合以下领域:

  1. 便携式设备: 由于其小巧的封装和低功耗特性,适用于智能手机、平板电脑、手持设备等便携式产品中。
  2. 嵌入式系统: 可以为各种嵌入式处理器和微控制器提供稳定的电源,适用于工业控制、智能家居、物联网设备等。
  3. 消费类电子产品: 在数码相机、移动电话充电器及其他小型电子系统中,SGM2225 可提供可靠的帮助。
  4. 通信设备: 用于基于低功耗设计的无线设备、传感器和通信模块,为稳定运行提供电力支持。
  5. 医疗设备: 可应用于便携式医疗设备,确保在关键时刻提供稳定电源,支持医疗操作的正常进行。

四、产品规格

  • 输出电压: 5V
  • 最大输出电流: 800mA
  • 封装类型: SOT-223-3
  • 工作温度范围: -40°C 至 +85°C
  • 输入电压范围: 4.5V 至 20V
  • 静态电流: 典型值为 30μA

五、设计注意事项

在设计使用 SGM2225-5.0XKC3G/TR 的电路时,工程师需注意以下事项:

  1. 输入电压选择: 输入电压必须在推荐范围内,以确保稳压输出且不影响器件的工作寿命。
  2. 电源布局: 注意布局设计,尽量缩短输入电容、输出电容等元件与IC之间的距离,以优化电源的抗干扰能力和工作稳定性。
  3. 散热处理: 虽然SOT-223-3封装相对较小,但在高负载条件下,可能会产生一定的热量,设计时需考虑有效的散热措施。
  4. 外部元件选型: 输出电容的类型和电量会对稳压性能和瞬态响应有所影响,需根据实际需求进行合理选用。

六、总结

SGM2225-5.0XKC3G/TR 是一款高效、稳定且具有多种保护功能的电源IC,非常适合用于对空间和功率敏感的多种应用。结合其优秀的性能与多用途特性,SGM2225-5.0XKC3G/TR 是电子工程师在设计电源电路时的理想选择。无论是在便携式设备、嵌入式系统,还是其它众多电子应用中,均能发挥出其优异的性能,为产品的稳定运行提供有力保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.