WMSIC Electronic Components

SGMICRO 74AVC8T245XTQQ24G/TR 74AVC8T245XTQQ24G

Model74AVC8T245XTQQ24G/TR
PackageTQFN-24L
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO 74AVC8T245XTQQ24G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
74AVC8T245XTQQ24G/TR
Electronic Component
1
Package
TQFN-24L
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
74AVC
Electronic Component
0.2g
Electronic Component
1
Features
Isolated; Output; Level Conversion
Electronic Component
BM0226870188
Operating Temperature
40℃~+125℃
Operating Voltage
0.8V~3.6V
Output Type
Electronic Component
Type
Electronic Component
Current(IOH)
12mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74AVC8T245XTQQ24G/TR 产品概述

一、简介

SGMICRO(圣邦微)出品的 74AVC8T245XTQQ24G/TR 是一款 8 位双向总线收发器,属于 74AVC 系列,面向混合电压系统的高速双向数据传输与电平兼容需求。器件支持三态输出,可用于总线隔离、互联与电压域之间的安全通信。

二、主要特性

  • 工作电压范围:0.8V 至 3.6V,适配低功耗与传统逻辑电压域。
  • 每片位数:8 位,单芯片即可处理一个字节的数据通道。
  • 通道类型:双向,支持方向控制以实现 A↔B 双向数据传输。
  • 输出类型:三态(可通过输出使能实现总线共享与隔离)。
  • 驱动能力:下拉/下拉电流 IOL / 上拉电流 IOH 均为 12 mA(典型驱动能力,实际请参考详尽数据手册)。
  • 温度等级:工作温度 -40℃ 至 +125℃,满足工业级环境需求。
  • 封装:TQFN-24L,低高度、小外形,利于空间受限设计与良好散热。
  • 系列特性:74AVC 系列兼具高速与低功耗特点,常用于现代数字系统互联。

三、典型应用场景

  • 微处理器/FPGA 与外设之间的总线互联与隔离。
  • 不同电压域(例如 1.2V/1.8V/3.3V)之间的电平移位与数据缓冲。
  • 电池供电与便携式设备中对低压兼容的高速数据通道。
  • 工业控制、通信接口与多主总线系统的总线驱动与三态管理。

四、封装与可靠性

封装为 TQFN-24L,适合表面贴装 SMT 生产,具有良好热阻特性。器件满足 -40℃ 到 +125℃ 的宽温工作范围,适用于严苛工业环境。器件型号末尾的 /TR 通常表明卷带(Tape & Reel)供货形式,便于贴片生产线使用。

五、设计与布局建议

  • VCC 端宜在近邻放置 0.1μF 陶瓷旁路电容以抑制瞬态噪声;多位并排走线时注意回流路径。
  • 高速信号走线应尽量短且阻抗匹配,减少串扰与反射。
  • 未使用的输入/输出应按数据手册建议处理(上拉或下拉),避免浮空引发功耗或不确定状态。
  • TQFN 中央热焊盘应按厂商推荐开窗与过孔布局以优化焊接可靠性与散热。

六、选型与注意事项

在最终选型与电路实现前,请参阅 SGMICRO 官方数据手册,确认绝对最大额定值、电气特性曲线、时序图和引脚定义。针对具体系统,关注功耗、时序裕度与 ESD/故障保护要求,以确保系统长期可靠运行。若需批量采购,请与供应链确认 G/TR 后缀的具体包装与交付细节。

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