WMSIC Electronic Components

SGMICRO SGM2202-3.3YN5G/TR SGM2202

ModelSGM2202-3.3YN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SGMICRO SGM2202-3.3YN5G / TR
Type
SGMICRO
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
1.3V@(150mA)
Electronic Component
SGMICRO
Electronic Component
SGM2202-3.3YN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.093g
Electronic Component
1
Features
Terminal Block
Electronic Component
BM0228580188
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
36V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2202-3.3YN5G/TR 产品概述

1. 产品简介

SGM2202-3.3YN5G/TR 是由知名电子元器件制造商 SGMICRO(圣邦微)推出的一款高性能电源管理集成电路(IC),采用 SOT-23-5 封装。该产品专为低功耗应用设计,具有高效率、低静态电流以及出色的负载和线路调整率,广泛应用于各类电源供电场合。

2. 主要特性

  • 输出电压: SGM2202-3.3YN5G/TR 标定输出电压为 3.3V,适合许多常见数字电路和模拟电路供电需求。
  • 高效率: 本产品采用了先进的电源管理技术,确保在不同负载条件下都能够保持高转换效率,降低能耗,延长电池寿命。
  • 低静态电流: SGM2202 的静态电流较低,非常适合用于便携式设备和电池供电的应用,最大静态电流仅为 30µA。
  • 良好的负载与线路调整率: 该芯片在不同输入电压和负载变化下,能够保持稳定的输出电压,确保系统的可靠运行。
  • 保护功能: 内置短路保护、过热保护和过压保护功能,提高了系统的安全性和稳定性,避免因异常情况导致设备损坏。
  • 宽工作温度范围: 适应 -40°C 至 +125°C 的工作温度范围,适合在各种环境条件下应用。

3. 封装与结构

SGM2202-3.3YN5G/TR 采用 SOT-23-5 封装,尺寸小巧,方便在空间有限的 PCB 板上实现集成。该封装使得该芯片占用较少空间,同时也支持较高的功率密度,提高了整体设计的灵活性。

4. 应用领域

SGM2202-3.3YN5G/TR 的特性使其在多个领域具有广泛应用潜力,主要包括:

  • 消费电子: 智能手机、平板电脑、便携式音响及其他便携设备。
  • 工业设备: 传感器、微控制器、模块化电源系统及其他配件。
  • 物联网(IoT)设备: 智能家居、农业监控设备、环境传感器等应用场景。
  • 汽车电子: 电子控制单元(ECU)及车载智能设备。

5. 设计考虑

在设计使用 SGM2202-3.3YN5G/TR 的电源电路时,需要注意以下几点:

  • 输入电压范围: 确保输入电压在芯片工作范围内,通常为 4.5V 至 15V。
  • 输出电流: 需根据负载需求选择合适的电流,SGM2202 可以提供的最大输出电流为 300mA,需确保负载电流不超过此值。
  • 输入和输出电容器: 为了提高电源供应的稳定性,建议在输入和输出端使用合适的电容器,通常选择低ESR的陶瓷电容器能有效提升响应速度与稳定性。
  • 热管理: 在高负载情况下,保证良好的热管理是必要的,尤其是在高温环境中使用时,适当的散热措施能有效提高芯片的工作可靠性。

6. 结论

SGM2202-3.3YN5G/TR 是一款功能强大、集成度高、便于使用的电源管理 IC。其轻松满足多种应用场景的电源需求,是设计师在选择电源管理解决方案时非常值得考虑的选项。通过合理的电路设计与布局,SGM2202 具备优异的性能和可靠性,为现代电子设备提供稳定的电源支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.