WMSIC Electronic Components

SGMICRO SGM2045-2.80XXDH4G/TR SGM2045

ModelSGM2045-2.80XXDH4G/TR
PackageXTDFN-4L(1x1)
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2045-2.80XXDH4G / TR
Type
XTDFN-4L(1X1)
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
150mV@(300mA)
Electronic Component
SGMICRO
Electronic Component
9.5uVrms
Electronic Component
SGM2045-2.80XXDH4G/TR
Electronic Component
1
Package
XTDFN-4L(1x1)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0264534087
Operating Temperature
40℃~+125℃
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
2.8V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2045-2.80XXDH4G/TR 产品概述

一、产品简介

SGM2045-2.80XXDH4G/TR 是圣邦微(SGMICRO)推出的一款高性能线性稳压器(LDO),输出极性为正极,固定输出电压为2.8V,适用于空间受限、对噪声和电源纹波有较高要求的便携与工业终端。器件采用 XTDFN-4L (1×1 mm) 超小封装,集成多重保护功能,可靠性高,适合电池供电或从 5.5V 总线降压到 2.8V 的场景。

二、主要性能参数

  • 工作电压:最大 5.5V
  • 输出电压:固定 2.8V
  • 输出电流:最高 300mA
  • 压差(Dropout):150mV @ 300mA
  • 静态电流(Iq):典型 15μA,适合低功耗应用
  • 输出噪声:9.5μVrms
  • 电源纹波抑制比(PSRR):92dB @ 1kHz,抗纹波能力强
  • 输出类型:单通道、固定输出
  • 工作温度范围:-40℃ ~ +125℃
  • 封装:XTDFN-4L (1×1 mm)
  • 保护与控制:过流保护、短路保护、过热关断、使能(EN)控制

三、功能亮点与应用价值

  • 超低静态电流与小压差相结合,能在低电压差条件下实现高效稳压,延长电池寿命;
  • 高 PSRR(92dB@1kHz)与低噪声特性,适合对模拟前端、ADC、射频或高精度传感器十分敏感的应用;
  • 集成 OCP/SCP/热关断和使能功能,提升系统可靠性并支持电源管理与电源序列控制;
  • 1×1 mm 超小封装,有利于空间受限的移动设备、可穿戴、物联网节点、便携式医疗及工业控制等终端。

四、设计注意事项

  • 当输入电压接近最大 5.5V 且输出电流接近 300mA 时,应关注稳压器功耗 (P = (Vin – 2.8V) × Iout) 与系统散热,必要时在 PCB 布局上采用散热铜箔或增加热沉路径;
  • EN 引脚可用于实现软启动与电源管理,推荐在系统上实现合理的上电时序;
  • 在输入与输出端建议并联适当的陶瓷旁路电容以保证稳定性与抑制瞬态响应;
  • 在高频敏感场合,注意布局与接地,利用靠近 LDO 的去耦电容以发挥最佳 PSRR 与低噪声性能。

SGM2045-2.80XXDH4G/TR 以其小尺寸、低静耗、高 PSRR 与完善的保护策略,是对噪声与功耗有严格要求系统的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.