WMSIC Electronic Components

SGMICRO SGM4027-3.3XN3LG/TR SGM4027

ModelSGM4027-3.3XN3LG/TR
PackageSOT-23
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM4027-3.3XN3LG / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM4027-3.3XN3LG/TR
Electronic Component
1
Package
SOT-23
Electronic Component
Voltage Reference IC
Electronic Component
±0.1%
Electronic Component
0.04g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0227715825
Operating Temperature
40℃~+125℃
Operating Voltage
3.5V~5.5V
Electronic Component
35ppm/℃
Output Voltage
3.3V
Output Current
10mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM4027-3.3XN3LG/TR 产品概述

一、产品简介

SGM4027-3.3XN3LG/TR 是圣邦微(SGMICRO)推出的一款固定输出电压基准芯片,输出为 3.3V。该器件面向需要高精度、低噪声和低功耗的测量与采集系统,例如 ADC 参考、传感器供电、便携仪器和工业控制。器件采用 SOT-23 小封装,便于空间受限的板级设计与量产装配。

二、主要性能

  • 输出类型:固定(3.3V)
  • 工作电压:3.5V ~ 5.5V
  • 最大输出电流:10 mA(可驱动小负载或为后级电路提供基准电源)
  • 初始精度:±0.1%
  • 温度系数:35 ppm/℃(典型)
  • 静态电流(Iq):典型 245 μA(低功耗,适合电池供电系统)
  • 低频噪声(0.1 Hz – 10 Hz):8.9 μV p-p
  • 噪声(10 Hz – 10 kHz):39.1 μV rms
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装:SOT-23
    这些参数表明 SGM4027 在精度、温漂和噪声控制上均表现优异,适合对基准稳定性要求较高的应用。

三、优势与典型应用场景

优势:

  • 高初始精度(±0.1%)保证系统在出厂时具备良好的基准精度,减少后续校准次数。
  • 低温漂(35 ppm/℃)使得在广泛温度范围内保持较小的漂移,适合工业和户外环境。
  • 低噪声特性(0.1 Hz–10 kHz 范围内)对高分辨率 ADC 和精密信号链非常有利。
  • 低静态电流(245 μA)兼顾性能与功耗,适合电池供电或低功耗设备。
  • SOT-23 小封装利于空间受限的设计。

典型应用:

  • 精密 ADC/DAC 的参考电源
  • 温度/压力/光电等高精度传感器系统
  • 手持仪表与便携式测试设备
  • 数据采集模块、工业控制与过程监控
  • IOT 设备和电池供电终端,需要在低功耗下保持高精度参考

四、封装与订货信息

  • 型号:SGM4027-3.3XN3LG/TR
  • 品牌:SGMICRO(圣邦微)
  • 封装:SOT-23(便于表面贴装)
    在订购与替换时请确认完整料号与包装形式(如卷带/盘装)以满足生产需求,并参考厂商的最新出货与生命周期信息。

五、设计与布局建议

为确保器件达到数据手册标称性能,建议在 PCB 设计与电路应用时注意以下要点:

  1. 电源与旁路电容:在 VIN 和 VOUT 端分别放置低 ESR 陶瓷旁路电容(例如 0.1 μF 至 1 μF),并尽量靠近封装引脚放置以抑制高频噪声与瞬态。具体容值与 ESR 请参考数据手册的稳定性建议。
  2. 接地处理:将基准的地回路与系统大电流地分开,采用星形或短回路路径接地,减少地噪声通过参考输入耦合到输出。
  3. 热量管理:尽管静态功耗低,但在高环境温度或靠近高发热元件时,应评估局部温升对参考温漂的影响,必要时使用散热或布局隔离措施。
  4. 负载要求:器件能提供至多 10 mA 的输出电流,尽量避免长期在极限电流工作以减少温度相关误差。对于需驱动更大负载的场合,考虑后级缓冲放大器。
  5. 干扰源隔离:将高频开关、数字总线或大电流走线远离参考芯片和其旁路电容,减少耦合干扰。

六、注意事项与选型建议

  • 供电裕量:器件工作电压下限为 3.5V,确保系统供电在稳态下高于该值;若系统供电较接近 3.3V,需选用更低最低工作电压的参考或提高供电电压。
  • 输出驱动能力:10 mA 适合多数基准用途,但在需要驱动多个后级或长期高电流时需评估是否需要缓冲。
  • 封装与环境:SOT-23 适合大多数商用和工业应用,但在极端振动或严苛热循环环境下需评估机械与焊接工艺可靠性。
  • 阅读数据手册:在最终设计前务必参照 SGMICRO 官方数据手册,确认典型值与最大值、引脚配置、外部元件要求及封装尺寸等详细信息。

总结:SGM4027-3.3XN3LG/TR 提供了高精度、低噪声、低温漂与低功耗的组合,适合对参考稳定性要求较高且空间受限的应用场景。通过合理的电源旁路、接地和热管理,可在宽温区间内实现稳定可靠的基准输出。

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