WMSIC Electronic Components

SGMICRO SGM2036-1.0YN5G/TR SGM2036

ModelSGM2036-1.0YN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
SGMICRO SGM2036-1.0YN5G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM2036-1.0YN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.041g
Electronic Component
1
Features
Output
Electronic Component
BM0228973008
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2036-1.0YN5G/TR 产品概述

一、产品简介

SGM2036-1.0YN5G/TR 是圣邦微(SGMICRO)推出的一款固定输出 1.0V 线性低压差稳压器(LDO),采用 SOT-23-5 小封装并以卷带(/TR)方式供货,适合空间受限且要求稳定低压供电的便携与嵌入式系统。器件集成使能控制、短路与过流保护、输出放电和热关断等多种守护功能,提升电源可靠性与系统安全性。

二、主要功能特性

  1. 使能控制(EN)
  • 器件带独立使能引脚,可以通过外部逻辑信号实现开关控制,便于系统电源管理与节能策略的实现。
  • 禁能时器件通常将输出拉低或快速放电(具有输出放电功能),避免系统处于未知电压区间。
  1. 短路保护与过流保护
  • 内置短路和限流保护,能够在输出短路或过流条件下限制输出电流,保护器件与负载。
  • 这种保护通常采用恒流或折返限流机制,能在故障解除后自动恢复工作,减少维护成本。
  1. 输出放电
  • 一旦进入禁止状态,输出放电功能可将输出节点迅速放回接地电平,防止残留电荷影响后续电路或造成上电冲突。
  1. 热关断
  • 当器件因过载或环境温度升高导致结温过高时,热关断机制会自动切断输出,以防器件损坏。温度下降到安全范围后,器件可自动重启。
  1. 小尺寸封装
  • SOT-23-5 封装占板面积小,适合空间受限的移动设备、手持仪器或多通道电源模块设计;TR 表示以卷带形式供货,利于量产贴片组装。

三、典型应用场景

  • SoC/FPGA/ASIC 的内核电压供给和基准电源
  • 电池供电设备的低压子系统(例如:传感器、收发模块)
  • 工业控制与测量仪器中对稳定低压电源的需求
  • 通信终端、便携式音视频设备及可穿戴设备
  • 电源管理模块及精密模拟前端的局部稳压

四、设计与布局要点

  • 输入与输出去耦:为保证稳定性与瞬态性能,建议在 VIN 与 GND 之间以及 VOUT 与 GND 之间放置适当的旁路电容(通常采用低 ESR 陶瓷电容),并尽量靠近器件引脚布局。
  • 输出电容兼容性:请参考器件完整数据手册选择合适电容类型和容值,以确保环路稳定性。常见做法是在输出并联适量陶瓷电容以获得低噪声与良好短路响应。
  • 接地与散热:SOT-23-5 封装散热受限,建议在 PCB 布局中使用较大的接地铜皮或多层接地层以提高散热能力,并缩短 VIN/VOUT/GND 的走线以降低压降与噪声耦合。
  • 使能控制:使能引脚应设计为受控逻辑输入,必要时在使能线上加上上拉/下拉电阻以避免上电时悬空导致不确定状态。
  • 保护与冗余:尽管器件集成了保护功能,关键系统仍建议结合外部熔断、限流或监测电路以提升整机可靠性。

五、可靠性与选型建议

  • 在选型时,请根据实际负载电流、输入电压范围、热环境和所需稳压精度查阅并确认数据手册中的电气参数、功耗与热阻指标。
  • 进行 PCB 样机验证时,重点测试短路响应、温升行为、禁能切换与上电/断电顺序对系统影响,确保在目标工况下性能稳定可靠。
  • 若系统需长期运行于高温或高负载工况,请评估是否需要降额设计或增加散热措施。

六、封装与采购信息

  • 型号示例:SGM2036-1.0YN5G/TR(固定输出 1.0V,SOT-23-5 封装,卷带供货)
  • 具体封装引脚定义、标记规则与订购编码请参考圣邦微官方数据手册与最新产品规格说明,或联系供应商确认库存与供货时间。

七、结论要点

  • SGM2036-1.0YN5G/TR 是一款集成多种保护与管理功能的 1.0V 固定输出 LDO,适用于对体积、可靠性和低电压供电有较高要求的应用。
  • 选用时应结合实际热工况和外围元件(尤其输出电容)进行验证,确保系统稳定性与长期可靠性。
  • 推荐在设计初期获取并参考完整数据手册及参考电路,以便正确使用使能、放电和保护特性,缩短产品开发周期。

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