WMSIC Electronic Components

SGMICRO SGM2210-3.3XN5G/TR SGM2210

ModelSGM2210-3.3XN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2210-3.3XN5G / TR
Type
SGMICRO
Minimum package
3000

Technical parameters

Electronic Component
95mV@(100mA)
Electronic Component
SGMICRO
Electronic Component
48uVrms
Electronic Component
SGM2210-3.3XN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.043g
Electronic Component
1
Features
Output
Electronic Component
BM0227691417
Operating Temperature
40℃~+125℃
Operating Voltage
20V
Output
Electronic Component
Output Voltage
3.3V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2210-3.3XN5G/TR 产品概述

一、产品简介

SGM2210-3.3XN5G/TR 是圣邦微(SGMICRO)推出的一款固定输出 3.3V 线性低压差稳压器(LDO),面向对噪声、纹波抑制和低静态功耗有严格要求的应用。器件支持最高 20V 的工作电压,最大输出电流 300mA,集成多重保护功能,适合便携设备与精密模拟系统供电。

二、主要电气性能(典型/关键参数)

  • 输出电压:3.3V(固定型)
  • 最大工作电压:20V
  • 最大输出电流:300mA
  • 压差(Dropout):95mV @ 100mA(在更大电流时压差会相应上升,设计时应留有余量)
  • 静态电流(Iq):36µA(适用于电池供电与低功耗系统)
  • 电源纹波抑制比(PSRR):100dB @ 1kHz(对交流纹波和开关噪声有极强抑制能力)
  • 输出噪声:48µVrms(低噪声输出,利于精密 ADC、射频前端等)
  • 输出极性:正极,单通道输出

三、保护与控制特性

  • 短路保护(Short-circuit protection):在输出短路或过载情况下限制电流,保护器件与系统。
  • 过流保护(OCP):防止过大输出电流导致器件损坏。
  • 过温保护(OTP):在芯片温度异常升高时自动关闭输出,避免热失控。
  • 使能功能(EN):外部使能引脚用于节电、上电顺序和系统控制(高电平/低电平启用方式请参见数据手册)。

四、典型应用场景

  • 便携式电池设备:手机配件、穿戴、手持终端(低Iq 与高 PSRR 结合适合电池供电)
  • 精密模拟电路:ADC/DAC、电压参考供电(低噪声、低纹波)
  • 无线与射频前端:对电源噪声敏感的射频模块供电
  • 工业与汽车电子(工作温度 -40℃ 至 +125℃):要求宽温度稳定性的系统供电

五、设计与布局建议

  • 输入/输出旁路电容:为保证稳定性与瞬态响应,应在输入端与输出端靠近器件焊盘放置低等效串联电阻(ESR)的陶瓷电容。常见取值范围为 1µF–10µF,具体请以厂家数据手册推荐值为准。
  • 热设计:尽管器件支持 300mA 输出,长期高电流会产生较大功耗(P = (VIN - VOUT) × IOUT),需要评估 PCB 散热能力,必要时增加铜面积或使用散热层。
  • 布线与地平面:将输入电容与稳压器输入端紧邻布置,输出电容靠近输出引脚,地线尽量回流到公共地平面,减少噪声耦合。
  • 启动与顺序:利用 EN 引脚实现电源序列控制或省电模式。上电顺序和使能逻辑应按系统需求设计,避免在高 VIN 且未使能时出现异常电压。

六、封装与获取信息

本型号后缀中含有 TR(卷带)包装信息,具体封装尺寸与焊盘建议请参考圣邦微官方数据手册与封装图纸。如需样片或批量采购,建议向代理商确认封装版本与可靠性报告。

总结:SGM2210-3.3XN5G/TR 结合了低压差、低静态电流、高 PSRR 与低噪声特性,并具备多重保护机制,适合要求电源洁净且关注功耗与可靠性的各类电子系统。在具体设计中,请查阅完整数据手册以获取详尽的电气特性、典型应用电路及封装信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.