WMSIC Electronic Components

SGMICRO 74LVC08XTS14G/TR 74LVC08XTS14G

Model74LVC08XTS14G/TR
PackageTSSOP-14
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO 74LVC08XTS14G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
74LVC08XTS14G/TR
Electronic Component
1
Package
TSSOP-14
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.179g
Electronic Component
1
Channel Count
4
Features
Electronic Component
Electronic Component
BM0256924723
Operating Temperature
40℃~+125℃
Operating Voltage
1.2V~3.6V
Logic Type
and Gate
Current(IOH)
24mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74LVC08XTS14G/TR 产品概述

一、概述

74LVC08XTS14G/TR 是圣邦微(SGMICRO)推出的 74LVC 系列四路二输入与门(Quad 2-Input AND)。器件适用于 1.2V 至 3.6V 的单电源系统,工作温度范围宽(-40℃ 至 +125℃),适合便携式、通信和工业控制等低压高速数字电路应用。

二、主要特性

  • 逻辑类型:与门(AND),每路 2 个输入,共 4 路通道。
  • 工作电压:1.2V ~ 3.6V,兼容常见 1.8V/3.3V 系统。
  • 静态电流(Iq):典型 20 μA(低功耗)。
  • 输出驱动能力:IOH / IOL = 24 mA,适合直接驱动中等负载。
  • 传播延迟:tpd ≈ 6 ns(在 3.3V、CL=50 pF 条件下)。
  • 输入阈值:VIH = 2.0 V(高电平),VIL = 0.8 V(低电平)。
  • 输出电平:VOH 约 2.45 V ~ 2.75 V,VOL 约 250 mV ~ 550 mV(受负载影响)。
  • 工作温度:-40℃ ~ +125℃。
  • 封装:TSSOP-14,便于 PCB 密集布线与自动贴装。

三、电气与系统设计要点

  • 由于器件最大工作电压为 3.6V,不应直接用于 5V 总线,若需与 5V 逻辑互联需使用电平移位或受限输入方案。
  • 为保证输出电平和传输性能,在驱动大电容或多输入负载时应考虑串联阻抗或缓冲器,避免振铃与过冲。
  • 必须在 VCC 与 GND 之间放置去耦电容(如 0.1 μF)、并靠近封装电源引脚布局,以抑制瞬态电流和供应噪声。
  • 器件本身静态电流低,适合对功耗敏感的电池供电系统,但在频繁切换或高负载输出时仍会产生瞬态功耗,应评估总体能耗。

四、应用场景

  • 组合逻辑实现:门控信号、条件使能、地址/片选逻辑。
  • 数字信号整合:多路控制信号的条件判断与控制。
  • 中等负载驱动:直接驱动 LED 指示(限流)、小继电器/光耦前端(需评估电流与电压)。
  • 嵌入式系统和通信模块的逻辑接口与信号整形。

五、封装与选型建议

TSSOP-14 封装适合 SMT 生产与空间受限的设计。选型时注意确认工作电压平台、输出驱动与输入阈值匹配下游器件;若系统存在较大容性负载或需要更高 IO 驱动能力,可考虑级联缓冲器或驱动放大器。

本器件型号:74LVC08XTS14G/TR,品牌:SGMICRO(圣邦微)。在设计时,请参照厂家完整数据手册获取详细的电气特性曲线、引脚定义和可靠性信息,以确保在具体应用中的兼容性与长期稳定性。

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