WMSIC Electronic Components

SGMICRO SGM2034-3.3YN3G/TR SGM2034

ModelSGM2034-3.3YN3G/TR
PackageSOT-23-3
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2034-3.3YN3G / TR
Type
SGMICRO
Minimum package
3000

Technical parameters

Electronic Component
110mV@(100mA)
Electronic Component
SGMICRO
Electronic Component
SGM2034-3.3YN3G/TR
Electronic Component
1
Package
SOT-23-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.5g
Electronic Component
1
Features
Current
Electronic Component
BM0230266696
Operating Temperature
40℃~+85℃@(Tj)
Operating Voltage
7.5V
Output
Electronic Component
Output Voltage
3.3V
Output Current
250mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2034-3.3YN3G/TR 产品概述

一、产品简介

SGM2034-3.3YN3G/TR 是圣邦微(SGMICRO)推出的一款固定输出型低压差线性稳压器(LDO),输出电压为 3.3V,适用于对功耗与噪声有较高要求的便携和电池供电系统。该器件集成过流保护与过热保护,单通道正极输出设计,工作温度范围宽(-40℃~+85℃,以芯片结温为准)。

二、关键参数一览

  • 输出类型:固定(3.3V)
  • 最大输出电流:250 mA
  • 工作电压(输入):最高 7.5 V
  • 压差(Dropout):约 110 mV @ 100 mA
  • 静态电流(Iq):典型 1 μA(超低静态电流,利于电池寿命)
  • PSRR:38 dB @ 217 Hz(中低频纹波抑制良好)
  • 保护功能:过流保护、过热保护
  • 输出极性:正极,单输出通道
  • 工作温度:-40℃ ~ +85℃ (Tj)

三、性能亮点

  • 极低静态电流(1 μA 级),非常适合长期待机或窃电敏感的电池供电设备;
  • 低压差特性(100 mA 时约 110 mV),在较小输入-输出压差下仍可维持稳定输出,提升效率并减小功耗;
  • 具备基本的安全保护(过流与过热),提高系统可靠性;
  • 中低频 PSRR 性能良好,适合为模拟前端与数字电路提供相对洁净的电源。

四、典型应用场景

  • 可穿戴设备与便携式终端;
  • 低功耗物联网节点、传感器节点;
  • MCU、存储器和模拟电路的本地参考/供电;
  • 工业与消费类小功率供电场合。

五、设计与使用建议

  • 输入电压应高于输出电压加上压差余量:例如在 100 mA 工作点,VIN ≳ 3.3V + 0.11V。若工作电流接近 250 mA,压差会增加,需留足裕量;
  • 注意功耗与散热:当 VIN 较高且输出电流较大时,芯片功耗(P = (VIN−VOUT)×IOUT)可能达到瓦级,应通过合理 PCB 铜箔、散热通道或降低 VIN−VOUT 来控制结温;
  • 输出电容与布局:为确保稳态与瞬态性能,请按厂方资料选择并布局输入/输出旁路电容,常见采用低 ESR 陶瓷电容;
  • 若对高频纹波抑制有更高要求,可辅以滤波网络或更大电容及布局优化。

六、封装与可靠性提示

本概述未列出具体封装型号与引脚图,请以原厂数据手册为准。芯片在高温或高功耗工况下需满足结温限制,建议在最终方案中进行热仿真与实测验证。

七、总结

SGM2034-3.3YN3G/TR 以极低静态电流、较低压差和完整的保护功能定位于低功耗与便携市场。适合为 MCU、传感器及其它小功率负载提供稳定的 3.3V 电源,但在高 VIN−VOUT 或接近额定电流时需注意功耗与散热设计。欲获取详细参数、电气特性曲线和封装信息,请参考圣邦微官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.