WMSIC Electronic Components

SGMICRO SGM7SZ00YN5G/TR SGM7SZ00YN5G

ModelSGM7SZ00YN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
SGMICRO SGM7SZ00YN5G / TR
Type
SOT-23-5
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM7SZ00YN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Logic Gate
Electronic Component
1g
Electronic Component
1
Electronic Component
BM69419960
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM7SZ00YN5G/TR 产品概述

一、产品简介

SGM7SZ00YN5G/TR 是由圣邦微(SGMICRO)生产的一款高性能 CMOS 逻辑门,封装形式为 SOT-23-5。作为一种基本的逻辑门电路,SGM7SZ00YN5G/TR 主要用于实现各种数字逻辑功能,广泛应用于电子设备和系统中。它是现代数字电路设计中不可或缺的基本单元。

二、主要特点

  1. 高性能 CMOS 技术:SGM7SZ00YN5G/TR 采用先进的 CMOS 工艺,具有低功耗、高速和高噪声容限的优点。这使得该器件能在较宽的电源电压范围内稳定工作,适合于高密度集成电路设计。

  2. 逻辑功能:此逻辑门可用于构建基本逻辑函数,如与门、或门等。用户可以使用多个 SGM7SZ00YN5G/TR 逻辑门组合实现复杂的逻辑运算,满足不同应用需求。

  3. 广泛的应用范围:

    • 数字电路:适合各类电子产品的数字电路设计,如计算机、数字信号处理器和嵌入式系统。
    • 工业自动化:在传感器信号处理、逻辑控制等方面有广泛应用。
    • 消费电子:广泛用于家电、手机、平板等消费电子产品中,提升内容处理能力和响应速度。
  4. 封装优势:SOT-23-5 封装小巧,适合于对空间有高要求的应用。其优异的散热性能和稳定性确保了电路的可靠性。

  5. 工作温度范围:SGM7SZ00YN5G/TR 设计时考虑了不同工作环境的需求,提供了良好的工作温度范围,从而可以在各种工业和消费环境中稳定运行。

三、技术规格

  • 封装类型:SOT-23-5
  • 电源电压:适合工作电压范围为 1.8V 至 5.5V,适应多种电源配置。
  • 逻辑高电平与低电平:对输入信号的高低电平具有良好的灵敏度,确保信号的准确传输。
  • 功耗特性:在多种工作模式下,SGM7SZ00YN5G/TR 显示出极低的静态功耗,符合现代低功耗设计理念。

四、应用实例

  1. 嵌入式系统:在嵌入式设计中,SGM7SZ00YN5G/TR 可用作数据处理和控制信号处理的逻辑单元,简化电路设计。
  2. 传感器接口:可用于传感器数据采集和处理,作为信号的处理和转换接口。
  3. 信号路由:在复杂数字电路中,可以用来实现信号的逻辑路由,提升信号的整合与处理效率。

五、总结

SGM7SZ00YN5G/TR 作为一款高效、低功耗的逻辑门,凭借其优异的性能和灵活的应用性,能够满足各种数字电路的设计需求。其小巧的 SOT-23-5 封装使其特别适用于空间受限的电子产品设计。同时,圣邦微注重产品的稳定性和可靠性,使其在严苛环境下依然能够实现良好的工作性能。

总之,SGM7SZ00YN5G/TR 是一种理想的选择,适用于现代电子产品的多种场合,为电子工程师和设计师提供了可靠的解决方案,推动了数字电路技术的进一步发展和创新。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.