WMSIC Electronic Components

SGMICRO SGM41523YTDF12G/TR SGM41523YTDF12G

ModelSGM41523YTDF12G/TR
PackageTDFN-12-EP(3x3)
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM41523YTDF12G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM41523YTDF12G/TR
Electronic Component
1
Package
TDFN-12-EP(3x3)
Electronic Component
Battery Management
Electronic Component
0.166g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0228061952
Operating Temperature
40℃~+85℃
Operating Voltage
4.2V~12V
Battery Type
Battery
Battery
1
ICType
IC
0VBattery
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM41523YTDF12G/TR 产品概述

一、产品简介

SGM41523YTDF12G/TR 是圣邦微(SGMICRO)推出的一颗单节锂电池开关式充电管理芯片,最大恒流充电能力可达2.5A。器件封装为 TDFN-12-EP (3×3,DFN-3×3-12L),适用于空间受限且需良好热散逸的便携电源方案。工作温度范围为 -40℃ 至 +85℃,输入工作电压范围 4.2V ~ 12V,充电饱和电压典型值为 4.45V,专为单节锂离子/锂聚合物电池的高效充电设计。

二、主要特性

  • 单节电池开关充电拓扑,支持最高 2.5A 恒流充电。
  • 宽输入电压范围:4.2V ~ 12V,适配各种 USB 或适配器输入。
  • 充电终止与电压调节:充电截流/恒压控制,饱和电压约 4.45V(请以数据手册为准)。
  • 封装紧凑且带散热焊盘的 TDFN-12-EP,便于 PCB 热管理与高密度布局。
  • 采用开关充电架构,较线性充电器具备更高的能效与更低的发热需求(需外置电感与滤波电容)。

三、典型应用

  • 单节锂电池供电的便携式消费电子:蓝牙音箱、手持终端、可穿戴设备等。
  • 便携式医疗设备与测量仪器。
  • 小型移动电源和充电宝(单节架构或作为前级充电管理)。
  • 工业与物联网节点需高可靠充电管理的场景。

四、封装与热管理

TDFN-12-EP (3×3) 带有露底焊盘(Exposed Pad),有利于将热量通过 PCB 散出。建议在 PCB 设计时:

  • 在露底焊盘下方采用多层过孔连接至内/底层铜箔以增强散热。
  • VIN、SW、BAT 等高电流走线尽量短且宽,靠近器件引脚布局外部电感和电容。
  • 留意器件在高温条件下的降额工作,必要时增大散热面积或采取散热片。

五、外围电路与设计要点

  • 开关拓扑需配套外置电感,电感电流额定值应高于充电电流峰值。
  • 输入/输出端配置低 ESR 电容以稳定环路与降低纹波。
  • 通过外部电阻或 PROG 引脚设置恒流值,遵循数据手册计算与元件选型。
  • 若需电池温度监测,请接入热敏(NTC)到相应 TS 引脚(如器件支持)。
  • 布局上尽量将高频回路环路面积最小化,保持敏感信号与大电流回路隔离。

六、注意事项

  • 请严格遵循器件数据手册中的最大额定参数与推荐外围元件清单,尤其是电感、肖特基二极管/器件要求(若需要)与电容类型。
  • 在高环境温度或高充电电流下,器件可能进入热限制模式以保护电池与芯片,请根据系统工况合理选型与散热。
  • 充电管理仅为电池充电部分,整机设计仍需考虑电池保护、过压/过流/短路保护与电池管理系统(BMS)的完整性。

七、总结

SGM41523YTDF12G/TR 以其 2.5A 的充电能力、宽输入电压范围与紧凑散热良好的 TDFN 封装,适合对效率、体积与散热有较高要求的单节锂电池应用。设计时重点关注外围电感与滤波、PCB 热管理以及按数据手册配置的保护与电流设定,以保证长期可靠运行。欲获取详细脚位定义、典型电路与完整电气特性,请参照圣邦微官方数据手册与设计指南。

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