WMSIC Electronic Components

SGMICRO SGM6610YTQS20G/TR SGM6610YTQS20G

ModelSGM6610YTQS20G/TR
PackageTQFN-4.5×3.5-20L
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM6610YTQS20G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM6610YTQS20G/TR
Electronic Component
1
Package
TQFN-4.5×3.5-20L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.188g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM69420107
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.7V~12V
Switching Frequency
200kHz~2.2MHz;500kHz
Electronic Component
Electronic Component
Output Voltage
4.5V~12.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM6610YTQS20G/TR 产品概述

一、产品功能与主要规格

SGM6610YTQS20G/TR 是一款升压型同步整流 DC-DC 开关稳压器,适用于从 2.7V 到 12V 的输入电压升压至可调输出电压 4.5V 至 12.6V。器件为单通道输出、内置开关管的升压拓扑,最大输出电流可达 10A,开关频率可在 200kHz~2.2MHz 范围内工作,典型值为 500kHz。静态电流极低,仅 220nA,工作环境温度范围为 -40℃~+85℃(TA)。封装为 TQFN-4.5×3.5-20L,品牌为 SGMICRO(圣邦微)。

二、器件亮点

  • 同步整流设计:内置高/低侧开关,实现同步整流,显著降低导通损耗,提高总体效率,减少对外部肖特基二极管的依赖。
  • 宽输入与可调输出:支持宽输入电压并能输出 4.5V~12.6V 的可调电压,适配多种系统电压需求。
  • 高输出能力:内置开关管,支持高达 10A 连续输出,适合电源需求较高的负载。
  • 可配置开关频率:200kHz~2.2MHz 的频率范围,用户可在效率、滤波器体积与 EMI 之间进行权衡;典型工作点为 500kHz。
  • 低待机功耗:220nA 的超低静态电流,有利于电池供电或低功耗待机场景。

三、典型应用场景

  • 可穿戴与便携设备需从单节/多节电池升压至更高电压的场合;
  • 汽车与工业控制模块的局部升压电源(满足车载电源范围时需确认额外资格);
  • 通信设备、摄像模组或传感器供电,需大电流输出及高效率转换的应用;
  • 各类需要小体积、高功率密度的电源管理设计。

四、设计与布局建议

  • 输入侧靠近芯片布置足够的去耦电容,减小环路阻抗;输出侧采用低 ESR 电容以降低纹波。
  • 选择电感时优先考虑饱和电流高于最大输出电流、低 DCR 的型号,配合目标开关频率与电流纹波设计。
  • 同步整流器件已内置,无需外接肖特基,但仍需评估导通损耗与热耗散。
  • PCB 布局应最小化开关环路面积,电感与输出电容靠近器件放置,同时为散热焊盘打通过孔提高散热能力。

五、热管理与可靠性

TQFN-4.5×3.5-20L 封装带有热焊盘,建议在 PCB 下方布置大面积铜箔并使用多颗过孔导热,以提升热流散能力。工作在高负载时需关注结温上升,必要时进行散热评估以保证长期可靠性。器件额定工作温度 -40℃~+85℃(TA),应在此范围内设计系统余量。

六、封装与订购信息

器件型号:SGM6610YTQS20G/TR,封装:TQFN-4.5×3.5-20L,TR 表示卷盘(Tape & Reel)包装。设计时请参考厂商数据手册获取完整引脚定义、典型应用电路与详细电气参数,按应用需求选择外部元件并进行热、EMI 与稳定性验证。

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