WMSIC Electronic Components

SGMICRO SGM8276-2XS8G/TR SGM8276

ModelSGM8276-2XS8G/TR
PackageSOIC-8
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM8276-2XS8G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM8276-2XS8G/TR
Electronic Component
1
Package
SOIC-8
Electronic Component
Operational Amplifier
Electronic Component
0.175g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0227336246
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
55mA
(SR)
8V/us
Power Supply Voltage
3.3V~36V
Static Current(Iq)
1.4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM8276-2XS8G/TR 产品概述

SGM8276-2XS8G/TR 是圣邦微(SGMICRO)推出的一款双通道轨到轨运算放大器,面向对低噪声、低偏置、宽电压范围和高线性度有要求的模拟前端应用。该器件以 10 MHz 的增益带宽积、8 V/µs 的压摆率以及 10 nV/√Hz 的输入电压噪声密度,在精密信号调理与驱动场景中表现出良好的平衡性,并且支持宽幅单/双电源供电与工业级温度范围,适合工业、仪表与便携式设备等多类应用。

一、主要特性

  • 放大器数:2(双运放)
  • 轨到轨输入与轨到轨输出,最大化输入/输出动态范围
  • 增益带宽积(GBW):10 MHz
  • 压摆率(SR):8 V/µs
  • 输入电压噪声密度:10 nV/√Hz @ 1 kHz
  • 输入失调电压(Vos):300 µV,失调电压温漂(Vos TC):1 µV/℃
  • 输入偏置电流(Ib):50 pA;输入失调电流(Ios):10 pA
  • 共模抑制比(CMRR):110 dB
  • 静态电流(Iq):1.4 mA(典型)
  • 输出驱动能力:55 mA
  • 工作温度范围:-40 ℃ 至 +125 ℃
  • 单电源电压范围:3.3 V 至 36 V;双电源:±1.65 V 至 ±18 V
  • 封装:SOIC-8
  • 品牌:SGMICRO(圣邦微)

二、关键参数解读

  • 增益带宽积 10 MHz:在闭环放大中,闭环带宽近似等于 GBW / 闭环增益;例如闭环增益为 10 时,理论带宽约为 1 MHz,适用于中低频精密放大与滤波应用。
  • 轨到轨输入/输出:可利用近乎整个供电范围进行输入测量与输出驱动,适合低电压供电或单电源系统,减少对电平偏移器的需求。
  • 低噪声与高 CMRR:10 nV/√Hz 的噪声与 110 dB 的共模抑制比,使其在小信号放大、传感器接口和差分信号处理中能获得更好的信噪比与抗干扰性。
  • 低输入偏置电流与低失调漂移:50 pA 级别的偏置电流和 1 µV/℃ 级失调温漂,有利于高阻抗传感器(如桥式传感器、热电偶)和长时间稳定测量。

三、性能优势

  • 宽电源电压范围与工业温度等级,适用于电池供电、工业控制与汽车电子(需确认具体车规等级)等场景。
  • 输出驱动能力(55 mA)允许直接驱动一些小负载或后端驱动器,减少外部缓冲器需求。
  • 低静态电流(1.4 mA)在保持性能的同时兼顾功耗,适合对能耗敏感的便携设备。
  • SOIC-8 封装便于 PCB 实作和散热管理,适合批量化生产与常见贴装流程。

四、典型应用

  • 传感器信号调理(应变计桥路、热电偶、光电探测前端)
  • 数据采集前置放大器与滤波器
  • 仪器仪表输入缓冲与差分信号放大
  • 便携式医疗设备与电池供电系统
  • 工业过程控制与模拟信号接口

五、封装与机械信息

  • 封装类型:SOIC-8,适用于常规 SMT 工艺
  • 推荐在 PCB 布局中为电源端添加 0.1 µF 至 1 µF 的去耦电容,并靠近器件电源引脚放置,以抑制高频噪声与保证稳定性。

六、设计指导与注意事项

  • 稳定性与闭环设计:SGM8276-2 提供良好的带宽与压摆率,但在驱动大容性负载(例如长电缆或并联电容)时,可能出现振荡或环路不稳定。建议在必要时加入小电阻(串联在输出端)或相应的补偿网络以保持稳定。
  • 噪声优化:若关注系统噪声,应采用低阻值反馈网络以降低热噪声贡献,同时确保源阻抗较低以匹配器件的噪声特性。
  • 偏置与漂移管理:对于精密直流测量,可采用外部失调调节或软件校准以补偿 300 µV 的失调及温度漂移。
  • 电源与去耦:为发挥高 CMRR 与低噪声特性,确保电源净化与去耦良好;在双电源应用中注意对称布局与地线回路最小化。
  • 热管理:虽然静态电流低,但在高输出电流工作下(接近 55 mA)会产生功耗,需关注封装温升及环境散热。

七、总结

SGM8276-2XS8G/TR 是一款面向精密测量与通用模拟前端的双通道轨到轨运放,兼具低噪声、低偏置、高 CMRR 及宽电源范围的特点。其 10 MHz GBW 与 8 V/µs 的动态性能适合多数中低频精密放大场景。正确的 PCB 布局和去耦设计、结合适当的闭环补偿,可以在工业与便携式应用中获得稳定且高保真的信号放大效果。若需更详细的电气特性曲线、典型应用电路或评价板建议,可进一步查阅官方数据手册或联系厂商技术支持。

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