WMSIC Electronic Components

SGMICRO SGM2039A-3.3XXEV8G/TR SGM2039A

ModelSGM2039A-3.3XXEV8G/TR
PackageXTDFN-8L
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2039A-3.3XXEV8G / TR
Type
SGMICRO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
88mV@(1A)
Electronic Component
SGMICRO
Electronic Component
11uVrms
Electronic Component
SGM2039A-3.3XXEV8G/TR
Electronic Component
1
Package
XTDFN-8L
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.024g
Electronic Component
1
Features
Current; Output
Electronic Component
BM0228217430
Operating Temperature
40℃~+125℃
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2039A-3.3XXEV8G/TR 产品概述

一、产品简介

SGM2039A-3.3XXEV8G/TR 是圣邦微(SGMICRO)推出的一款固定输出线性稳压器,输出电压为 3.3V,最高输出电流为 1A。器件采用 XTDFN-8L 封装,工作温度范围 -40℃ 至 +125℃,集成多重保护功能(过流保护、短路保护、过热保护)并带使能(EN)引脚,适用于对噪声与电源纹波有严格要求的系统电源管理。

二、主要性能参数

  • 输出类型:固定(3.3V)
  • 工作电压(最大):5.5V
  • 输出电流:1A(最大)
  • 压差(Dropout):88mV @ 1A
  • 电源纹波抑制比(PSRR):88dB @ 1kHz
  • 噪声:11 μVrms
  • 静态电流(Iq):55 μA
  • 输出极性:正极,单通道
  • 保护功能:过流保护(OCP)、短路保护(SCP)、过热保护(OTP)
  • 封装:XTDFN-8L

三、关键特性与优势

  • 低压差:88mV @ 1A 的低压差在高电流负载下仍能保持较小的电压损失,适合低压差供电场景。
  • 优异的 PSRR 与低噪声:88dB(1kHz)和 11 μVrms 的低噪声特性,适合模拟前端、射频模块与高精度传感器供电。
  • 低静态电流:典型 55 μA 的静态电流有利于延长电池供电系统的待机时间。
  • 全面保护与使能控制:内建 OCP/SCP/OTP 与 EN 引脚,便于系统级电源管理与可靠性设计。

四、典型应用场景

  • 便携式与电池供电设备(智能手表、便携终端)
  • 工业控制与传感器节点、物联网终端(IoT)
  • 射频前端与无线通信模块的低噪声供电
  • 单片机、数模混合电路的本地稳压供电

五、应用注意与布局建议

  • 输出电容:为确保稳定性与瞬态响应,建议在输出端使用低 ESR 陶瓷电容(如 X5R/X7R),典型值 1 μF~10 μF,电容应尽量靠近器件输出引脚放置并用短走线连接。
  • 输入电容:在输入端并联一只合适的陶瓷电容(例如 1 μF~10 μF)以抑制输入源阻抗与突发电流。
  • 热管理:在最大输入电压与满载条件下,器件的功耗可达 (Vin–Vout)×Iout(例如 Vin=5.5V、Vout=3.3V、Iout=1A 时功耗约 2.2W),须通过在 PCB 下方留足铜箔散热区、添加过孔并连接底层热平面来降低结壳温升,避免触发过热保护。
  • 布局要点:输入/输出走线尽量加宽、缩短,地线采用星形或完整地平面接法,EN 引脚加上上拉/下拉电阻以实现可靠的上电复位与软启动控制。

六、器件选型与系统集成建议

  • 若系统要求更低静态电流或更高输出电流,可比较同系列或其他型号的 LDO;
  • 在对热余量要求高的应用(连续大电流、高温)应评估外部散热措施或考虑降额工作;
  • 结合 PCB 工程热仿真与实际测量验证器件在目标工况下的结温与稳定性,确保长期可靠运行。

SGM2039A-3.3XXEV8G/TR 以其低压差、优秀的 PSRR 与低噪声、以及完整的保护机制,适合对电源质量与可靠性有较高要求的便携与工业类应用。

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