WMSIC Electronic Components

SGMICRO SGM2211-3.3XN5G/TR SGM2211

ModelSGM2211-3.3XN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2211-3.3XN5G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM2211-3.3XN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.043g
Electronic Component
1
Features
Output; Built-in;;;; Current
Electronic Component
BM0257246527
Operating Temperature
40℃~+125℃
Operating Voltage
20V
Output
Electronic Component
Output Voltage
3.3V
Output Current
500mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2211-3.3XN5G/TR 产品概述

一、概述

SGM2211-3.3XN5G/TR 是圣邦微(SGMICRO)推出的一款高性能单通道线性稳压器(LDO),输出极性为正极,固定输出电压为 3.3V,最大输出电流可达 500mA。器件集成丰富保护与控制功能,采用 SOT-23-5 小封装,适用于空间受限且对电源质量和可靠性要求较高的应用场景。

二、主要性能指标

  • 工作电压(最大):20V
  • 输出电压:3.3V(固定)
  • 输出电流:最高 500mA
  • 电源纹波抑制比(PSRR):100dB @ 1kHz
  • 静态电流(Iq):43μA
  • 工作温度范围:-40℃ ~ +125℃
  • 封装:SOT-23-5
  • 输出通道数:1

三、关键功能及优势

  • 使能控制(EN):支持外部使能/关断控制,便于电源管理与系统上电顺序控制,关断时功耗极低。
  • 输出放电:关断时快速将输出卸载至地,避免残余电压影响下游电路响应或复位判定。
  • 内置软启动与可调软启动:限流并平滑上电电流,减少电源突入电流和输出电压过冲;可调软启动满足对不同负载和开机时序的优化需求。
  • 保护功能完备:具备短路保护、过流保护、反极性/反向电流保护、热关断与输入欠压保护,提高系统可靠性并防止异常工况损伤器件及负载。
  • 高 PSRR(100dB@1kHz):对输入纹波和噪声抑制能力强,适合对模拟、射频或精密采样电路的电源供给。
  • 低静态电流(43μA):在待机或轻载时功耗低,适合便携式与电池供电系统。

四、典型应用场景

  • 便携式与电池供电设备(智能终端、手持仪器)
  • 工业控制与传感器节点(需要较宽工作温度范围)
  • 通信与网络设备的低噪声电源轨
  • MCU、模拟前端与射频模块的稳压供电
  • 各类需高可靠性与保护功能的嵌入式系统

五、建议使用与布局要点

  • 输入与输出端应靠近器件放置去耦电容,保证瞬态响应与稳定性;建议使用低等效串联电阻(ESR)陶瓷电容以降低噪声。
  • 如果使用可调软启动功能,参考数据手册合理配置软启动电容或外部元件以获得期望上电曲线。
  • 在高电流应用下注意散热与布板铜箔面积,尽量缩短高电流回路走线,避免热聚积导致热关断触发。
  • 对关键模拟/射频模块,结合器件高 PSRR 特性和良好接地设计以获得最佳噪声抑制效果。

六、封装与选型信息

SGM2211-3.3XN5G/TR 提供 SOT-23-5 小封装,适合体积受限电路板与通用 SMT 工艺。产品型号后缀包含托盘/卷带等包装信息,选型时请注意工作温度等级与包装形式以满足量产与可靠性要求。

如需原理图参考、典型应用电路或更详细的电气特性曲线,请参阅圣邦微官方数据手册或联系供应商获取完整资料。

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