WMSIC Electronic Components

SGMICRO SGM48754YTS14G/TR SGM48754YTS14G

ModelSGM48754YTS14G/TR
PackageTSSOP-14
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM48754YTS14G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM48754YTS14G/TR
Electronic Component
1
Package
TSSOP-14
Electronic Component
Signal Switch / Codec / Multiplexer
Electronic Component
0.179g
Electronic Component
1
Features
Level Conversion
Electronic Component
BM0227548978
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Power Supply
Power Supply
Static Current(Iq)
0.001uA
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM48754YTS14G/TR 产品概述

一、产品简介

SGM48754YTS14G/TR 是圣邦微(SGMICRO)推出的一款低功耗信号开关/编解码器/多路复用器,封装为 TSSOP-14。器件以单电源供电,工作电压范围宽(2.5V 至 5.5V),工作温度范围为 -40℃ 至 +85℃,静态电流极低(Iq ≈ 0.001 μA),适合对功耗和电平兼容性有较高要求的系统中实现信号切换与电平转换功能。

二、主要规格亮点

  • 电源极性:单电源设计,简化系统电源管理。
  • 工作电压:2.5V ~ 5.5V,支持常见低压微控制器与 5V 逻辑器件之间的电平兼容。
  • 工作温度:-40℃ ~ +85℃,满足工业级温度要求。
  • 静态电流:极低漏电/静态电流(约 0.001 μA),非常适合电池供电和超级电容供电的低功耗应用。
  • 功能特性:电平转换、信号开关与多路复用功能,适用于模拟与数字信号的路由与隔离。
  • 封装:TSSOP-14,适合中小批量 SMT 组装及系统板设计。

三、性能优势

  • 极低静态功耗:在待机或低活动场景中几乎不消耗电流,可显著延长电池寿命。
  • 宽电压兼容:2.5V ~ 5.5V 覆盖常见电压域,便于在混合电压系统中实现透明级联与互通。
  • 工业级温度范围与可靠性:适合工业控制、通信设备及户外终端等工作环境复杂的场景。
  • 封装与引脚密度平衡:TSSOP-14 在成本、焊接可靠性与 PCB 布局上取得较好折中。

四、典型应用场景

  • 移动与便携终端:电源受限的传感器采集、按键矩阵或低速数据总线切换。
  • MCU/FPGA 接口:实现多个电压域之间的控制信号或数据线切换与隔离。
  • 多路传感器采集:对多通道模拟或数字传感器信号进行时分复用或选择。
  • 工业控制与测试设备:信号路由、通道切换与电平兼容处理。
  • 低功耗 IoT 终端:休眠时几乎无耗电,唤醒时快速切换。

五、设计与使用要点

  • 引脚与功能:具体的引脚分配、控制逻辑极性、开关时序及导通阻抗等详细参数请参照厂商数据手册,设计时务必以数据手册为准。
  • 去耦与电源滤波:建议在 VCC 近端放置 0.1 μF 的去耦电容并靠近电源脚,保证开关瞬态期间的稳定性。
  • ESD 与浪涌保护:对外部 I/O 口可考虑增加一级保护(TVS 二极管或限流),尤其在工业或户外应用中。
  • PCB 布局:模拟/数字混合信号板上,保持开关信号线短且直,避免与高频或大电流走线并行,以降低串扰。
  • 功耗管理:利用器件的极低静态电流特性,可在系统睡眠状态下关闭或隔离不必要信号通道以节省能量。
  • 功率与热管理:器件用于信号路由,通常不会承受大电流与高功耗,但在高密度封装或高环境温度下仍需关注热堆积。

六、封装与制造信息

  • 封装形式:TSSOP-14,适配常见焊盘与回流工艺。
  • 生产与合规:采购时建议选择带有原厂标识的 TR(卷带)包装,以保证质量与可追溯性。
  • 引脚定义与焊盘设计:参考厂商推荐焊盘布局以保证焊接可靠性与一致性。

七、总结

SGM48754YTS14G/TR 以其单电源、宽工作电压、超低静态电流和工业级温度范围,适合用于低功耗、多电压域的信号切换与电平转换场合。在设计应用前,请务必查阅并遵循官方数据手册中的电气特性、引脚定义及使用注意事项,以确保系统性能与可靠性达到预期。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.