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SGMICRO SGM2039A-ADJXXEV8G/TR SGM2039A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- SGMICRO SGM2039A-ADJXXEV8G / TR
- Type
- SGMICRO
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SGMICRO
- Electronic Component
- SGM2039A-ADJXXEV8G/TR
- Electronic Component
- 1
- Package
- XTDFN-8L(1.2x1.6)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.024g
- Electronic Component
- 1
- Features
- Current; Output
- Electronic Component
- BM0257691212
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SGM2039A-ADJXXEV8G/TR 产品概述
一、简介
SGM2039A-ADJXXEV8G/TR 是圣邦微（SGMicro）推出的一款可调线性稳压器（LDO），采用紧凑的 XTDFN-8L (1.2 × 1.6 mm) 封装。器件集成了完整的保护与控制功能，适合对可靠性、尺寸和电源管理有较高要求的便携及工业应用。
二、主要功能特性
- 使能控制（EN）：支持外部逻辑信号开/关输出，便于系统电源管理和省电设计。
- 短路保护与过流保护：在负载过大或输出短路时自动限制电流，保障芯片与外部负载安全。
- 反极性电流保护：防止输出端倒灌电流回流至输入，避免系统异常或电池放电。
- 输出放电：关断时自动把输出节点放电到低电平，加快电源切换与系统复位。
- 热关断：内部温度异常升高时触发关断，防止热失控。
- 输入欠压保护（UVLO）：输入电压不足时禁止器件工作，保证上电可靠性。
三、封装与物理特性
器件采用 XTDFN-8L 微小封装（1.2 × 1.6 mm），适合高密度 PCB 设计与空间受限的移动设备。封装带有热焊盘，便于通过 PCB 散热。属于表贴工艺，便于自动化贴装与回流焊工序。
四、典型应用场景
- 便携式消费电子（智能穿戴、移动设备）
- 电池供电系统与电源管理模块
- 工业控制与传感终端（要求稳压与保护）
- IoT 节点、通信设备与车载子系统（非主电源）
五、设计与布局建议
- 严格遵循器件数据手册中对输入/输出旁路电容的推荐值与 ESR 要求，以保证稳态稳定性与瞬态响应。
- 把输入电容和输出电容尽量靠近器件引脚布局，缩短回流路径以降低寄生感抗。
- 热焊盘应与 PCB 大地平面或散热层良好连接，以提升散热能力并确保热关断在预期范围工作。
- EN 引脚逻辑电平与上拉/下拉电阻建议按数据手册配置，避免浮空导致状态不确定。
六、总结
SGM2039A-ADJXXEV8G/TR 是一款功能完备、封装微小的可调线性稳压器，集成多种实用保护特性与输出放电功能，非常适合对可靠性和体积有较高要求的电源管理场景。具体电气参数、引脚定义和推荐 PCB 尺寸应以厂商数据手册为准，设计时请参考并遵循产品规范以确保性能与可靠性。
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