WMSIC Electronic Components

SGMICRO SGM2205-3.3XKC3G/TR SGM2205

ModelSGM2205-3.3XKC3G/TR
PackageSOT-223-3
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2205-3.3XKC3G / TR
Type
SGMICRO
Minimum package
2500

Technical parameters

Electronic Component
850mV@(800mA)
Electronic Component
SGMICRO
Electronic Component
SGM2205-3.3XKC3G/TR
Electronic Component
1
Package
SOT-223-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.431g
Electronic Component
1
Features
Output
Electronic Component
BM0227327470
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
20V
Output
Electronic Component
Output Voltage
3.3V
Output Current
800mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2205-3.3XKC3G/TR 产品概述

一、产品简介

SGM2205-3.3XKC3G/TR 是圣邦微(SGMICRO)推出的一款固定输出线性低压差稳压器(LDO),输出电压为 3.3V,输出通道数 1,输出极性为正。器件工作电压可达 20V,适用于对噪声有较高要求且需稳定 3.3V 电源的系统设计。

二、主要性能参数

  • 输出电压:3.3V(固定)
  • 最大输出电流:800mA
  • 工作电压:最高 20V
  • 压降(Dropout):850mV @ 800mA
  • 静态电流(Iq):112μA(典型)
  • 电源纹波抑制比(PSRR):75dB @ 1kHz
  • 工作结温:-40℃ ~ +125℃ (Tj)
  • 保护特性:过流保护、短路保护、过热保护
  • 封装:SOT-223-3

三、性能亮点

  • 高 PSRR(75dB@1kHz),对开关电源噪声和射频干扰抑制效果优秀,适合敏感模拟或射频前端供电。
  • 较低静态电流 112μA,有利于待机功耗控制(在非连续高电流场景更为明显)。
  • 850mV 压差在 800mA 负载下表现良好,适配中等差分电压输入场景。

四、典型应用

  • 工业控制与自动化设备
  • 通信设备与射频前端供电
  • 嵌入式系统与微控制器电源
  • 消费电子中对噪声敏感的模拟电路供电

五、封装与热设计建议

SOT-223-3 封装热阻较大,设计时应重点考虑功耗与散热。线性稳压器的功耗 P = (Vin - Vout) × Iout。举例:Vin=5V、Iout=800mA 时 P≈1.36W;若 Vin=12V,则 P≈6.96W;Vin=20V 时 P≈13.36W,器件会迅速达到热关断阈值。建议在 PCB 布局中采用大面积铜箔散热、连接到地平面的散热焊盘,并在必要时使用外部散热片或改用降压转换器以降低功耗。

六、使用注意事项

  • 请参考官方数据手册选择合适的输入/输出旁路电容与等效串联电阻(ESR),以保证稳定性与瞬态性能。
  • 输入电容应靠近器件 VIN 引脚,输出电容靠近 VOUT 引脚并使用低 ESL/ESR 器件以改善瞬态响应。
  • 在高温或大电流工况下,应对热关断和过流保护行为进行验证,并考虑电源降额与热管理方案。
  • 设计时若需更高效率或更大功率耗散,应考虑开关降压器或外部功率分担方案。

如需原厂典型电路、引脚排列或更详细的外围元件建议,请提供是否需要数据手册或具体应用场景,我可进一步给出参考电路与布局建议。

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