WMSIC Electronic Components

SGMICRO SGM4717EP-YWQ10/TR SGM4717EP

ModelSGM4717EP-YWQ10/TR
PackageTQFN-10L(1.8x1.4)
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM4717EP-YWQ10 / TR
Type
TQFN-10L(1.8X1.4)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM4717EP-YWQ10/TR
Electronic Component
1
Package
TQFN-10L(1.8x1.4)
Electronic Component
Signal Switch / Codec / Multiplexer
Electronic Component
0.026g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0230826944
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Power Supply
Power Supply
Static Current(Iq)
5uA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM4717EP-YWQ10/TR 产品概述

一、概要

SGM4717EP-YWQ10/TR 是圣邦微(SGMICRO)推出的一款低功耗单电源信号开关/编解码器/多路复用器,适用于对空间、功耗和信号完整性有较高要求的便携与工业应用。器件支持单电源供电,工作电压范围宽达 1.8V 至 5.5V,工作温度为 -40℃ 至 +85℃,静态电流仅 5μA,特别适合电池供电或待机功耗受限的系统。

二、主要特性

  • 单电源供电,电压范围:1.8V ~ 5.5V,兼容常见逻辑电平;
  • 工作温度范围:-40℃ ~ +85℃,可满足工业级环境要求;
  • 低静态电流 Iq:5 μA,适合低功耗设计;
  • 先断后合(Break-Before-Make)功能:在切换过程中先断开现有通道再合上目标通道,有效避免短路或信号冲突,提升系统可靠性;
  • 小封装:TQFN-10L(1.8 × 1.4 mm),节省 PCB 面积,适合空间受限的应用板级封装。

三、典型应用

  • 音频/视频信号路由与选择;
  • 传感器信号多路采集与编解码;
  • 便携式设备中的复用与通道切换(如移动终端、手持设备);
  • 工业控制与自动化场景下的信号选择与隔离;
  • 低功耗、休眠主控系统的外围信号管理。

四、封装与环境要求

器件以 TQFN-10L 小型封装提供,标称尺寸 1.8 × 1.4 mm,适用于高密度 PCB 布局。器件符合工业温度等级,适合宽温场合长期运行。选型时应关注散热、焊接工艺与回流曲线对小封装引脚可靠性的影响。

五、设计与布局建议

  • 供电引脚应靠近去耦电容(如 0.1 μF )以抑制瞬态噪声与提高开关稳定性;
  • 控制信号与模拟/数据信号应合理分层,避免互相串扰;
  • 利用先断后合特性,可在多通道切换场合减少瞬态短路,但仍应避免在高电流瞬变下频繁切换;
  • 严格遵守输入输出电压不得超出器件供电轨(避免损坏);
  • 对于 ESD 敏感应用,建议在关键引脚增加防护措施并按照厂商推荐的 PCB 焊盘与过孔布局。

六、选型与订购信息

完整型号为 SGM4717EP-YWQ10/TR,由 SGMICRO(圣邦微)生产,封装为 TQFN-10L(1.8×1.4 mm)。在评估替代器件或进行系统级设计时,应参照器件数据手册获取详细引脚定义、时序规范、最大额定值及典型特性曲线,以确保电路匹配与可靠性。

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