WMSIC Electronic Components

SGMICRO SGM2033-1.2XN5G/TR SGM2033

ModelSGM2033-1.2XN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2033-1.2XN5G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
265mV@(250mA)
Electronic Component
SGMICRO
Electronic Component
26uVrms
Electronic Component
SGM2033-1.2XN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.041g
Electronic Component
1
Features
Output
Electronic Component
BM0227656392
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2033-1.2XN5G/TR 产品概述

一、产品简介

SGM2033-1.2XN5G/TR 是圣邦微(SGMICRO)推出的一款低功耗、低噪声、固定输出线性稳压器(LDO),输出电压为 1.2V,最大输出电流 250mA。器件采用 SOT-23-5 封装,适合对电源纯净度、待机功耗与体积有严格要求的便携与嵌入式系统。

二、主要规格

  • 输出类型:固定(1.2V)
  • 最大输入电压:5.5V(工作电压)
  • 输出电流:最大 250mA
  • 压差(Dropout):265mV @ 250mA
  • 静态电流(Iq):22µA(典型)
  • 噪声:26µVrms
  • 电源纹波抑制比(PSRR):94dB @ 1kHz
  • 保护:短路保护、热关断
  • 工作结温:-40℃ ~ +125℃(Tj)
  • 封装:SOT-23-5(/TR 表示带卷带包装)

三、关键特性与优势

  • 极低静态电流(22µA),非常适合电池供电设备,延长待机时间;
  • 高 PSRR(94dB@1kHz)与低输出噪声(26µVrms),对模拟前端、RF/ADC 供电有利;
  • 低压差(265mV@250mA),在靠近负载或低压差场合可提高效率;
  • 内置短路保护与热关断,增强系统可靠性并简化周边保护电路设计。

四、典型应用场景

  • 移动/便携设备的核心电源(MCU、数字逻辑低压域);
  • 传感器前端、ADC/DAC、参考电路的低噪声供电;
  • 无线射频模块前端或混合信号系统中对噪声要求高的电源;
  • 电池供电的工业与消费类产品。

五、设计与布板注意事项

  • 输出稳定性:建议使用低 ESR 陶瓷电容作输出滤波,常见取值范围为 1µF~10µF,具体以器件数据手册为准;输入端也需并联适当陶瓷电容以抑制瞬态与寄生。
  • 布局:输入、输出电容尽量靠近引脚放置,减少走线长度与回流路径阻抗,以保证稳定性与最佳 PSRR 性能。
  • 滤波与旁路:若系统对低频纹波极为敏感,可在输入侧增加 RC 或 Pi 滤波器,并留意滤波器对器件稳定性的影响。

六、热与保护考虑

SOT-23-5 的功耗承受受限。稳压器功耗约为 P = (Vin - 1.2V) × Iout。例:当 Vin = 5.5V、Iout = 250mA 时,P ≈ 1.075W,器件在无良好散热的 PCB 上可能达到热关断门限。建议:降低输入电压差、减小负载电流,或通过加大铜箔面积(散热地/散热垫)和优化布板散热来保证可靠工作。

七、封装与订购信息

  • 封装:SOT-23-5,适合空间受限设计;
  • 包装形式:/TR 表示带卷带(Tape & Reel)包装,便于表面贴装生产线使用。具体订购型号与最小订购量请参见圣邦微产品资料或联系经销商。

八、结论与建议

SGM2033-1.2XN5G/TR 以其低静态电流、优秀的 PSRR 与低噪声特点,适合对电源质量与能耗敏感的便携与混合信号系统。设计时重点关注输入-输出压差与器件热耗散,合理选择输入电压与输出电容,并做好布板散热与旁路,能发挥该 LDO 的最佳性能。如需更详细的电气特性、典型应用电路与 PCB 布局参考,请查阅官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.