WMSIC Electronic Components

SGMICRO SGM2034-3.0YN3G/TR SGM2034

ModelSGM2034-3.0YN3G/TR
PackageSOT-23-3
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2034-3.0YN3G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
130mV@(100mA)
Electronic Component
SGMICRO
Electronic Component
SGM2034-3.0YN3G/TR
Electronic Component
1
Package
SOT-23-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.084g
Electronic Component
1
Features
Current
Electronic Component
BM0230063727
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
7.5V
Output
Electronic Component
Output Voltage
3V
Output Current
250mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2034-3.0YN3G/TR 产品概述

一、主要特性

SGM2034-3.0YN3G/TR 是圣邦微(SGMICRO)推出的一款固定输出线性稳压器(LDO),输出电压为 3.0V,面向对低静态电流与低压差有严格要求的便携及电池供电应用。主要特性如下:

  • 输出类型:固定(3.0V)
  • 最大输出电流:250 mA
  • 压降(Dropout):130 mV @ 100 mA(注意:压降随输出电流增大而上升)
  • 静态电流(Iq):1 μA(极低静态电流,适合长待机/电池系统)
  • 保护特性:过流保护、热关断
  • 工作温度范围:-40 ℃ ~ +85 ℃(Ta)
  • 输出极性:正电压输出,单通道
  • 封装:SOT-23-3

二、性能参数要点

  • 低静态电流(1 μA):非常适合电池供电或待机功耗敏感的设备,能显著延长电池寿命。
  • 低压差(130 mV @100 mA):在中低电流工作点可实现极小的输入-输出电压差,便于在电池电压接近目标电压时仍能稳定供电。
  • 250 mA 峰值输出能力:能驱动中等负载的传感器、MCU或外设,但在高压差或高电流时需考虑热量管理。
  • 保护机制:内置过流限制与热关断,能在异常工况下保护器件与负载。

三、典型应用场景

  • 可穿戴设备、无线传感节点、物联网终端(对低Iq要求高的电池设备)
  • 便携式仪器、便携式音频设备中的电压基准与模拟供电
  • MCU、低功耗传感器及外围电路的 3.0V 稳压源
  • 电池降压或分支电源应用(当输入电压不远高于 3.0V 时最佳)

四、热设计与选型建议

由于器件为 SOT-23-3 小封装,热阻相对较高,功耗管理尤为重要。器件耗散功率 Pd = (Vin − Vout) × Iout。举例:若 Vin = 7.5V、Vout = 3.0V、Iout = 250 mA,则 Pd = (7.5 − 3.0) × 0.25 = 1.125 W,此功耗对于 SOT-23 封装通常难以散热,可能触发热关断或超温失效。因此建议:

  • 尽量使 Vin 接近 Vout,减少压降与功耗;
  • 在高电流工作时采用散热良好的PCB布局(加大铜箔面积、增加散热过孔);
  • 若需长时间250 mA输出且Vin较高,建议选用更大功耗能力的器件或加外部降压前级。

五、典型应用电路与注意事项

  • 建议在输入端和输出端各放置适当的旁路电容以提高稳定性与瞬态响应(常见做法:输入侧 1 μF~10 μF 陶瓷电容,输出侧根据实际应用选择低等效串联电阻(ESR)陶瓷或钽电容)。
  • 注意压差随电流变化,制造时确认在最坏工况下仍满足稳压要求。
  • 若负载为带电感性或有大突变电流的模块,应在布局上尽量缩短电容与芯片之间的回路,避免寄生振荡或瞬态过冲。
  • 利用器件的过流与热关断保护可提高系统鲁棒性,但不应依赖其作为常态过流限制手段。

六、封装与可靠性

  • 封装为 SOT-23-3,适合表面贴装与空间受限的应用场合。
  • 推荐在 PCB 设计时为引脚和散热路径预留足够铜面积,并遵循厂商推荐的焊盘与返锡要求以保证长期可靠性。
  • 工作温度范围为 -40 ℃ 到 +85 ℃,满足大多数商业与工业级低功耗设备的环境要求。

总结:SGM2034-3.0YN3G/TR 以其超低静态电流、低压差和必要的保护功能,在电池供电与低功耗系统中表现出色。设计时应重点关注输入电压选择与热管理,以发挥其在稳定性与能效方面的优势。若需更详细的电气参数、外围电容范围或典型特性曲线,建议参考圣邦微官方数据手册。

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