WMSIC Electronic Components

SGMICRO SGM8922YS8/TR SGM8922YS8

ModelSGM8922YS8/TR
PackageSOIC-8
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM8922YS8 / TR
Type
SGMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM8922YS8/TR
Electronic Component
1
Package
SOIC-8
Electronic Component
Operational Amplifier
Electronic Component
0.174g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0227300778
Operating Temperature
40℃~+85℃
Amplifier
2
Output Current
300mA
(SR)
6.8V/us
Static Current(Iq)
3mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM8922YS8/TR 产品概述

一、器件简介

SGM8922YS8/TR 是圣邦微(SGMICRO)推出的双路运算放大器,采用 SOIC-8 封装,针对单电源和低电压应用优化。器件具备轨到轨输出能力,能够在接近电源轨的电平下稳定驱动负载,适合便携设备和工业传感前端等需要最大输出摆幅的场合。

二、主要性能特点

  • 放大器数:2(双通道)
  • 轨到轨:轨到轨输出,扩展输出电压范围,提高单电源利用率
  • 输入失调电压 (Vos):典型 3 mV,便于低偏置误差的精密测量
  • 输入失调电压温漂 (Vos TC):1.6 μV/℃,在温度变化下保持高稳定性
  • 压摆率 (SR):6.8 V/μs,支持中等带宽信号的快速转换
  • 共模抑制比 (CMRR):108 dB,优异的共模干扰抑制能力
  • 静态电流 (Iq):3 mA(典型),在功耗与性能间取得平衡
  • 输出电流:最高可达 300 mA,适合驱动中等负载或作为缓冲级使用
  • 工作温度:-40℃ 至 +85℃,满足工业级温度要求
  • 封装:SOIC-8,便于标准 PCB 布局与批量生产

三、性能意义与应用价值

  • 精度与稳定性:3 mV 的输入失调配合 1.6 μV/℃ 的温漂,适合对直流精度有要求的信号调理、电压采样和低频滤波器等场景。
  • 抗干扰能力:108 dB 的 CMRR 能有效抑制共模噪声,利于差分传感器接口和长线传输前端。
  • 输出能力:轨到轨输出加上高达 300 mA 的输出电流,使其能直接驱动小型继电器、LED 阵列或作为功率级的驱动缓冲器。
  • 响应速度:6.8 V/μs 的压摆率足以应对多数数据采集前端、ADC 驱动及主动滤波器的瞬态需求。

四、典型应用场景

  • 便携式仪器与电池供电系统(需最大化单电源摆幅)
  • 传感器信号调理(温度传感、压力传感、电流检测等)
  • 数据采集系统的输入缓冲与驱动 ADC 的前端放大
  • 有源滤波器、积分/微分电路和低频放大器
  • 小功率负载驱动与电平转换应用

五、设计与使用建议

  • 电源旁路:建议在近电源引脚放置 0.1 μF 陶瓷与 1 μF 电解/钽电容并联做去耦,抑制高频及低频干扰。
  • 布局走线:关键信号与反馈回路应尽量缩短,采用完整地平面以降低干扰和偏移。
  • 热管理:在高输出电流或高功耗情况下注意器件结温,必要时考虑散热或降低占空比。
  • 稳定性:选择合适的反馈网络阻值,避免与大容性负载直接连接导致振荡,必要时加入小电阻或相位补偿。

六、总结与采购建议

SGM8922YS8/TR 以双通道、轨到轨输出、低失调与低温漂、较高输出电流为特征,适合对精度与输出驱动能力都有要求的中低速模拟前端。选型时建议参考完整数据手册核实供电电压范围、输入共模电压范围、输出摆幅与短路保护等细节,并根据应用场景评估热设计与 PCB 布局。若需进一步资料或样片,可联系 SGMICRO 官方或授权分销商获取数据手册与技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.