WMSIC Electronic Components

SGMICRO SGM2051-ADJXG/TR SGM2051

ModelSGM2051-ADJXG/TR
PackageWLCSP-0.8×1.2-6B-A
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2051-ADJXG / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
104mV@(1.2A)
Electronic Component
SGMICRO
Electronic Component
29uVrms
Electronic Component
SGM2051-ADJXG/TR
Electronic Component
1
Package
WLCSP-0.8×1.2-6B-A
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.038g
Electronic Component
1
Features
Current; Output
Electronic Component
BM0226916768
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
500mV~3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2051-ADJXG/TR 产品概述

一、概述

SGM2051-ADJXG/TR 是圣邦微(SGMICRO)推出的一款高性能可调线性稳压器(LDO),针对移动与便携类系统、射频前端和高精度模数电路等场景优化。器件支持正极输出、最大工作电压5.5V,输出电压可调范围为0.5V~3.3V,最大输出电流1.2A,适合为常见低压数字/模拟核供电或外设供电。

二、主要性能亮点

  • 宽输入电压:最高5.5V,兼容常见电源轨与锂电池方案。
  • 可调输出:0.5V~3.3V 范围内任意设定,满足多种电压需求。
  • 低压差:在满载1.2A时仅约104mV压差,有利于低差分供电,提升效率与续航。
  • 低噪声与高PSRR:29 μVrms 噪声与70dB@1kHz 的电源纹波抑制比,能有效抑制电源和开关噪声,对 ADC、射频与传感器等敏感模块尤为重要。

三、功能保护与控制

SGM2051 集成了多项实用保护与控制功能,提升系统可靠性与电源管理灵活性:

  • 短路保护与热关断(thermal shutdown):在异常或过载条件下自动限制或关断输出,防止器件损坏。
  • 反极性电流保护:防止电源关闭时因输出回流而影响上游电路。
  • 输出放电:关断时快速将输出电容放电,缩短下电恢复时间并利于系统复位。
  • 使能控制(EN):支持片上逻辑控制或电源序列管理。
  • 输入欠压保护(UVLO):保证在输入电压不足时不发生不稳定输出。

四、封装与温度范围

  • 封装:WLCSP-0.8×1.2-6B-A,超小封装适合空间受限的便携设备。
  • 工作温度:-40℃ 至 +125℃ (Tj),覆盖工业级温度需求。

五、典型应用场景

  • 手机、平板与可穿戴终端的核心或外设电源。
  • 无线通信与射频模块的低噪声电源(VCO/PA 偏置、射频前端)。
  • 精密模数/数模电路供电(ADC、DAC、传感放大器)。
  • 电池供电系统与多轨电源管理、I/O/外设电源轨。

六、设计注意事项与建议

  • 稳定性与去耦:请参考器件手册选用合适输出/输入电容(通常低ESR陶瓷),并将电容靠近输入/输出引脚布局,走线尽量短且铜箔充足。
  • 热管理:尽管器件为低压差设计,但在接近或满载1.2A时仍需要良好PCB散热(扩大GND与散热铜箔、增加过孔)。
  • 输出设定:采用外部电阻分压器设定输出电压,建议选用高精度、低温漂电阻并将反馈节点布线最短;具体参考参考电压与推荐阻值请参阅数据手册。
  • 电源序列与使能:合理利用使能脚与输出放电功能实现可靠的上电/断电序列。
  • 保护与系统级考虑:在并联或多轨系统中注意反向电流路径与保护元件配合。

七、总结与获取资料

SGM2051-ADJXG/TR 以其低压差、低噪声、高PSRR 与多项保护功能,适用于对噪声和空间有较高要求的移动与精密电源应用。欲获取完整电气特性图、典型应用电路和版图建议,请下载并参阅圣邦微官方数据手册和评估资料,以便完成可靠的电源设计与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.