WMSIC Electronic Components

SGMICRO SGM8532XMS/TR SGM8532XMS

ModelSGM8532XMS/TR
PackageMSOP-8
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM8532XMS / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM8532XMS/TR
Electronic Component
1
Package
MSOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.117g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0256011204
Operating Temperature
40℃~+125℃
Amplifier
2
Static Current(Iq)
18uA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM8532XMS/TR 产品概述

一、概览

SGM8532XMS/TR 是圣邦微(SGMICRO)推出的一款双通道运算放大器,封装为 MSOP-8。器件采用轨到轨输入与轨到轨输出设计,适合单电源或低电压系统,面向对输入偏置电流和功耗有严格要求的精密前端应用。型号后缀 TR 表示带卷(Tape & Reel)包装,便于表面贴装(SMT)生产线使用。

二、主要规格(核心参数)

  • 放大器数量:2(双通道)
  • 输入/输出范围:轨到轨输入,轨到轨输出
  • 输入偏置电流 (Ib):0.5 pA
  • 输入失调电流 (Ios):0.5 pA
  • 静态电流 (Iq):18 µA
  • 温度范围:-40 ℃ ~ +125 ℃
  • 功能特性:内置补偿(单位增益稳定)
  • 封装:MSOP-8

这些参数表明 SGM8532XMS/TR 为低功耗、超低输入偏置电流且稳定的放大器,特别适合需要高输入阻抗和长时间积分的场景。

三、性能与优势

  • 极低的输入偏置/失调电流(0.5 pA)使其非常适用于高阻抗传感器接口、霍尔/电容/光电传感器以及电荷放大器等需要抑制漏电误差的应用。
  • 轨到轨输入/输出拓宽了信号摆幅,使其在单电源供电和电池供电系统中能直接驱动接近电源的信号,减少级间电平转换电路。
  • 低静态电流(18 µA)利于延长电池供电系统的续航时间,适用于便携式或远程监测设备。
  • 内置补偿保证器件在单位增益下稳定,简化电路设计与环路稳定性考虑。

四、典型应用场景

  • 高阻抗传感器前端(光电、温度、电化学、电容检测)
  • 低功耗便携仪器、数据采集前置放大器
  • 精密滤波、积分器与采样保持电路
  • 工业控制与测量系统中对微小电流信号的放大与缓冲

五、设计与布局建议

  • 使用器件面向高阻抗输入时,注意 PCB 杂散泄漏:采用大介电常数、低吸湿性的材料,避免焊剂残留,必要时使用保护涂层或阻挡区域。
  • 在输入端采用护罩/护环(guard ring)技术以减少寄生泄漏电流,尤其在 picoamp 级别时更为重要。
  • 电源引脚附近放置 0.1 µF 陶瓷去耦电容(靠近引脚焊盘)以抑制瞬态和保持低噪声。
  • 对于高精度应用,遵循星形接地或分区接地原则,避免大电流回路与敏感输入靠近。

六、选型与注意事项

在选型时,若系统对输入电流极端敏感或要求轨到轨性能,SGM8532XMS/TR 是较佳选择。但因具体增益带宽、噪声和驱动能力等指标未在此处给出,建议在最终设计前参考完整数据手册并进行样片验证,评估在目标负载与频率范围内的稳定性与线性度。

如需进一步数据(如供电电压范围、增益带宽、输入电压噪声、输出驱动能力及引脚排列),可查阅 SGMICRO 官方数据手册或联系代理商获取技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.