WMSIC Electronic Components

SGMICRO SGM2019-1.8YC5G/TR SGM2019

ModelSGM2019-1.8YC5G/TR
PackageSC-70-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2019-1.8YC5G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
400mV@(300mA)
Electronic Component
SGMICRO
Electronic Component
30uVrms
Electronic Component
SGM2019-1.8YC5G/TR
Electronic Component
1
Package
SC-70-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.035g
Electronic Component
1
Features
Terminal Block
Electronic Component
BM0230661419
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2019-1.8YC5G/TR 产品概述

一、产品简介

SGM2019-1.8YC5G/TR 是 SGMICRO(圣邦微)推出的一款小封装、低噪声、低静耗的线性稳压器(LDO),为单路固定输出 1.8V 正向电压输出设计。器件采用 SC-70-5 小型封装,集成过流保护、过热保护及使能控制,适合对噪声和电源纹波有较高要求的便携与嵌入式系统。

二、主要性能参数

  • 输出类型:固定(1.8V)
  • 最大工作电压:5.5V
  • 最大输出电流:150 mA
  • 静态电流(Iq):典型 200 μA(低静耗,利于电池供电系统)
  • 噪声:30 μVrms(低噪声,利于模拟/ADC 前端设计)
  • 电源纹波抑制比(PSRR):74 dB @ 1 kHz,能有效抑制电源纹波对敏感电路的干扰
  • 压差(Dropout):文档参考值 400 mV @ 300 mA;在器件额定输出电流 150 mA 下,压差会更小
  • 保护特性:过流保护、过热保护
  • 额外功能:带使能(EN)引脚
  • 工作温度范围:-40 ℃ ~ +85 ℃(Ta)
  • 输出极性:正极,单通道输出

三、关键特性说明

  • 低噪声与高 PSRR:30 μVrms 的输出噪声和在 1 kHz 下 74 dB 的 PSRR,使 SGM2019 很适合给 ADC、传感器前端或射频混频器等对电源洁净度敏感的电路供电。
  • 低静态电流:200 μA 的静态电流在待机或低功耗场景能延长电池寿命,且带有使能功能可实现远程开/关以降低功耗。
  • 保护机制:内建过流保护和过热保护,提高系统可靠性,防止短路或散热不良时损坏器件。

四、典型应用场景

  • 电池供电的便携设备(如可穿戴、手持终端)
  • 单片机、传感器与模拟前端供电(需要低噪声与高 PSRR)
  • 工业与消费类低功耗模块
  • 通信与接口电路的 1.8V 供电

五、布局与热管理建议

  • 输入(VIN)和输出(VOUT)去耦电容应尽量靠近器件引脚放置,短而粗的走线可以降低寄生感抗。
  • 推荐使用低 ESR 陶瓷去耦电容以获得更好稳定性与低噪声输出(具体电容值请参照完整数据手册)。
  • SC-70-5 为小型封装,散热能力有限;在高负载或较高环境温度下,应在 PCB 上扩展铜箔面积并使用散热面(地/电源平面)以改善热传导。
  • 布局时为 EN(使能)引脚预留清晰走线,避免噪声耦合导致误触发。

六、封装与订购信息

  • 型号:SGM2019-1.8YC5G/TR
  • 品牌:SGMICRO(圣邦微)
  • 封装:SC-70-5(小型贴片封装)
  • 后缀 /TR 通常指卷带(Tape & Reel)包装,便于贴片生产线直接使用。具体订购编码与包装选项请参考制造商或授权分销商的最新资料。

七、使用注意事项

  • 在设计时请参考厂方正式数据手册中的典型应用电路与外部元件值,以确保稳定性与可靠性。
  • 高环境温度或连续大电流条件下需关注热关断机制,合理评估实际输出能力与温升。
  • 若系统对输出电压精度、瞬态响应或滤波要求严格,建议在评估阶段进行板级验证,确认在目标负载与输入条件下的实际表现。

如需进一步的电气特性曲线、典型应用电路或 PCB 参考布局图,可提供需求以便查询并给出更详细的设计建议。

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