WMSIC Electronic Components

SGMICRO LM324ZS14G/TR LM324ZS14G

ModelLM324ZS14G/TR
PackageSOIC-14
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO LM324ZS14G / TR
Type
SGMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
LM324ZS14G/TR
Electronic Component
1
Package
SOIC-14
Electronic Component
Operational Amplifier
Electronic Component
0.283g
Electronic Component
1
Features
Built-in
Electronic Component
BM0230856634
Operating Temperature
0℃~+70℃
Amplifier
4
Output Current
18mA
(SR)
350V/ms
Static Current(Iq)
860uA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM324ZS14G/TR 产品概述

一、产品简介

LM324ZS14G/TR 是圣邦微(SGMICRO)推出的一款四通道低功耗通用运算放大器,集成在 SOIC-14(SO14)封装中。器件内置补偿,适合单电源或双电源工作,具有宽工作电压范围和良好的共模抑制性能,能满足模拟信号处理中的常用放大、滤波、比较驱动等应用需求。

二、主要规格(典型/代表值)

  • 放大器通道数:4 通道
  • 增益带宽积:1.1 MHz
  • 压摆率(SR):350 V/ms
  • 输入失调电压(Vos):典型 1.2 mV,最大 6.6 mV
  • 输入偏置电流(Ib):10 pA
  • 输入失调电流(Ios):20 pA
  • 共模抑制比(CMRR):118 dB
  • 静态电流(Iq):860 μA(典型)
  • 待机电流:1.4 mA
  • 输出电流能力:18 mA
  • 工作电压:单电源 3 V ~ 32 V,双电源 ±1.5 V ~ ±16 V
  • 工作温度范围:0 ℃ ~ +70 ℃
  • 封装:SOIC-14(SO14)

三、关键特性

  • 内置补偿,易于建立稳定增益,外部补偿需求低,便于快速设计和调试。
  • 宽电源电压适应性,兼容低压便携设备与更高电压工业系统。
  • 较低的静态电流和待机电流,适合对功耗有一定要求的电池供电场景。
  • 高共模抑制和低输入偏置电流,增强在传感器前端和差分信号处理中的精度表现。
  • 输出驱动能力良好,可直接驱动小负载或后级电路。

四、典型应用场景

  • 传感器信号调理:应对低频、低幅度信号的放大与滤波。
  • 低功耗便携设备:在较低供电下仍能保持正常放大功能。
  • 仪表与数据采集前端:利用高 CMRR 与低偏置电流减少测量误差。
  • 主动滤波器、积分/微分电路、比较与缓冲驱动等通用模拟电路。

五、使用建议与注意事项

  • 电源去耦:建议在电源引脚附近并联 0.1 μF 陶瓷与 10 μF 低 ESR 电容,抑制瞬态与提高稳定性。
  • 布局:模拟信号线尽量短且远离数字干扰源,共模或差分信号走线注意对称,接地处理采用单点或固体地平面。
  • 输出负载:尽管可驱动最大 18 mA,长期驱动大电流会增加发热与功耗,应评估热设计与可靠性。
  • 输入保护:若可能遭受过压或反向输入,考虑在输入端加限流或钳位元件以保护输入级。
  • 工作温度与漂移:在精密测量场合注意 Vos 的温漂和最大值(典型 1.2 mV,最大 6.6 mV),必要时采用校准或偏置调整。

六、封装与订购信息

封装类型为 SOIC-14(SO14),适用于常见的表面贴装组装工艺。型号:LM324ZS14G/TR,品牌:SGMICRO(圣邦微)。如需批量采购或替代封装(DIP、TSSOP等),建议联系供应商确认可用封装与交期。

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