WMSIC Electronic Components

SGMICRO SGM6031-ADJYUDT6G/TR SGM6031

ModelSGM6031-ADJYUDT6G/TR
PackageUTDFN-1.5×2-6L
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
SGMICRO SGM6031-ADJYUDT6G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM6031-ADJYUDT6G/TR
Electronic Component
1
Package
UTDFN-1.5×2-6L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.029g
Electronic Component
1
Type
Electronic Component
Electronic Component
BM0000641343
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SGM6031-ADJYUDT6G/TR

1. 产品简介

SGM6031-ADJYUDT6G/TR是由著名的电子元器件制造公司SGMICRO(圣邦微)推出的一款高性能可调电源IC。该器件具有最大输出电流200mA和最高输出电压5.5V的特点,非常适合用于低功耗电子设备的电源管理。其紧凑的WLCSP封装(0.90×0.88-5B)和UTDFN(1.5×2-6L)封装设计,使得SGM6031在空间有限的应用场景中表现优异。

2. 性能特点

  • 输出电流: SGM6031-ADJYUDT6G/TR能够提供最高200mA的输出电流,能够满足大多数小型电子设备的功率需求。
  • 输出电压范围: 此IC支持可调输出电压,用户可以根据具体需求设置适当的电压,输出电压范围可调,最高可达5.5V。
  • 低静态电流: 由于设计优化,该器件在待机状态时消耗极低的静态电流,使得整体能效得以提升,适用于电池供电的便携式设备。

3. 应用场景

SGM6031-ADJYUDT6G/TR广泛应用于消费电子产品、医疗设备、便携式设备、传感器供电、以及其他需要稳定电源的电子系统。以下是一些具体的应用场景:

  • 便携式音响: 该电源IC可为便携式音响提供稳定的电源,确保在电源波动情况下设备性能不受影响。
  • 智能穿戴设备: 在智能手环、手表等小型设备中,SGM6031能够有效延长电池使用寿命,支持长时间的持续工作。
  • 传感器供电: 对于各类传感器,尤其是需要调节电压的应用场景,SGM6031提供了灵活的电源解决方案。
  • 移动医疗设备: 由于其低功耗特性,SGM6031非常适合用于移动医疗设备中,确保设备能够长时间运行并得到稳定供电。

4. 封装与布局

SGM6031-ADJYUDT6G/TR提供两种封装形式:WLCSP(0.90×0.88-5B)和UTDFN(1.5×2-6L)。这种小型化的封装设计使得该器件非常适合于空间受限的应用,例如小型便携设备内的PCB布局。设计工程师可以利用其紧凑尺寸,优化整个电路板的设计和空间利用率。

5. 设计考虑

在使用SGM6031时,设计工程师需要考虑以下几个设计因素:

  • 输入电压范围: 确保IC的输入电压在其工作范围内,以保证产品的稳定性和安全性。
  • 输出电压设定: 根据系统需求进行合理的电压设定,可以通过外部电阻膜进行调整。
  • 热管理: 在高负载条件下,IC可能会产生一定的热量,良好的散热设计将有助于提升器件的长期稳定性及可靠性。

6. 总结

SGM6031-ADJYUDT6G/TR是SGMICRO针对现代低功耗电子设备需求而设计的高性能可调电源IC。它不仅具备出色的电气特性,包括可调输出电压和低静态电流,还以其紧凑的封装形式兼具了高适应性,适合多种应用环境。对于希望在电源管理上达到高效率、长续航的设计工程师而言,SGM6031-ADJYUDT6G/TR无疑是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.