WMSIC Electronic Components

SGMICRO SGM2203-3.0YK3LG/TR SGM2203

ModelSGM2203-3.0YK3LG/TR
PackageSOT-89-3
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2203-3.0YK3LG / TR
Type
SOT-89-3
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
2.4V@(150mA)
Electronic Component
SGMICRO
Electronic Component
SGM2203-3.0YK3LG/TR
Electronic Component
1
Package
SOT-89-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.15g
Electronic Component
1
Electronic Component
BM0226997905
Operating Temperature
40℃~+85℃
Operating Voltage
36V
Output
Electronic Component
Output Voltage
3V
Output Current
150mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2203-3.0YK3LG/TR 产品概述

一、产品简介

SGM2203-3.0YK3LG/TR 是圣邦微(SGMICRO)推出的一款固定输出线性低压差稳压器(LDO),固定输出电压为 3.0V。器件为单路正向输出,封装为 SOT-89-3,适用工作温度范围 -40℃ 至 +85℃。主要规格包括:最大工作电压 36V、输出电流 150mA、静态电流(Iq)仅 4.2µA、在 1kHz 时电源纹波抑制比(PSRR)约 55dB,以及在满载 150mA 时的压差(Dropout)约 2.4V。器件集成过流保护和过热保护,便于系统可靠性设计。

二、主要特点

  • 低静态电流:Iq = 4.2µA,适合长待机、低功耗设计;
  • 宽输入电压范围:最高可达 36V,适合高压源降压到 3.0V 的场合;
  • 保护功能:内置过流保护(OCP)与过热保护(OTP),提高系统安全性;
  • 中等抑制性能:PSRR = 55dB@1kHz,能有效抑制中低频电源噪声;
  • 封装紧凑:SOT-89-3,适合面积受限但要求一定散热能力的方案;
  • 限制点:在 150mA 负载下压差较大(2.4V),对低压差场合不适合。

三、典型应用场景

适用于从高电压轨(如 9V/12V/24V)降至 3.0V 的电子设备:工业控制模块、仪表与传感器前端、通信终端模块、某些需要长待机但工作电流不大的便携设备等。注意如果输入电压接近 5V 或电流接近 150mA 时,因压差较大可能无法满足输出要求。

四、设计与布局要点

  • 输入/输出旁路电容应靠近器件引脚放置以保证稳定性和瞬态响应;遵循厂商关于电容种类与等效串联电阻(ESR)的推荐。
  • 热设计:功耗 Pd = (Vin - Vout) × Iout,应避免在高 Vin 与高 Iout 条件下长期工作(例如 12V→3V、150mA 时 Pd ≈ 1.35W),SOT-89-3 散热能力有限,需增大铜箔、设计散热过孔或降低 Vin 差。
  • 保护与滤波:在噪声或瞬态较大的输入侧可增加 TVS 或串联限流元件;对敏感负载加滤波电容或 L-C 以改善 PSRR 表现。
  • PCB 布局:尽量使用大面积地铜平面并做好输入/输出地回流,缩短高频回路路径。

五、优缺点总结及选型建议

优点:超低静态电流、支持较高输入电压、内置保护、封装小巧。
缺点:在满载时压差较高(限制了在低输入电压下的使用)、最大输出电流仅 150mA,SOT-89 散热受限。
选型建议:若系统需从较高电压稳压至 3.0V 且待机功耗要求严格,同时负载电流不超过中等水平,SGM2203-3.0 是经济且可靠的选择;若工作在低压差或大电流工况,应考虑低压差(LDO)或开关降压方案。

六、封装与采购信息

型号:SGM2203-3.0YK3LG/TR,品牌:SGMICRO(圣邦微),封装:SOT-89-3;“-TR”通常表示卷带盘装(Tape & Reel),便于贴片自动化生产。购买和最终设计请参考厂商最新规格书与布局参考电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.