WMSIC Electronic Components

SGMICRO 74LVC1T45XC6G/TR 74LVC1T45XC6G

Model74LVC1T45XC6G/TR
PackageSC-70-6
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO 74LVC1T45XC6G / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
74LVC1T45XC6G/TR
Electronic Component
1
Package
SC-70-6
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
74LVC
Electronic Component
0.035g
Electronic Component
1
Electronic Component
1
Features
Isolated; Level Conversion
Electronic Component
BM0229475509
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Output Type
Electronic Component
Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74LVC1T45XC6G/TR 产品概述

一、产品简介

SGMICRO(圣邦微)74LVC1T45XC6G/TR 是一款单位元(1-bit)、双向电平转换器,采用小型 SC-70-6 封装,工作电压范围宽(1.65V ~ 5.5V),并具备三态输出控制。器件属于 74LVC 系列,设计用于在不同供电电平之间实现高速、低功耗且可控的数字信号互联,适配多种低功耗微控制器、FPGA、传感器和外围器件之间的电平接口需求。

二、主要特性

  • 工作电压:1.65V ~ 5.5V,支持常见的 1.8V、2.5V、3.3V 和 5V 逻辑域。
  • 通道类型:单通道、双向数据传输,适用于两侧电平桥接。
  • 输出类型:带三态(High-Z)控制,便于总线共享与多主机场景。
  • 驱动能力:IOH / IOL 均为 32 mA,具备较强的输出驱动能力,可驱动中等负载。
  • 静态电流(Iq):典型仅 2 μA,适合电池供电及低功耗系统。
  • 传播延迟(tpd):5 ns(在 VCC=5V、CL=15 pF 时),可满足较高速度的数据交换需求。
  • 工作温度:-40 ℃ ~ +125 ℃,适合工业级环境使用。
  • 封装:SC-70-6(超小型封装),节省 PCB 面积,适合空间受限的应用。

三、功能与应用场景

74LVC1T45XC6G/TR 主要用于不同电压域设备之间的双向信号匹配与隔离。典型应用场景包括:

  • MCU/MPU 与外设(传感器、射频模块、存储器)的电平接口;
  • 同一信号线在两侧电源不同的点对点通信;
  • 多主机或共享总线系统中,通过三态控制实现总线仲裁与互联;
  • 移动/便携设备、穿戴式终端、嵌入式模块中对体积和功耗敏感的 I/O 电平转换。

四、使用建议与注意事项

  • 在系统设计中,确保 VCC 在工作电压范围内并可靠接地,以保证器件双向切换和三态功能的正确性。
  • 三态(高阻)控制引脚用于总线释放,系统多设备共享同一线路时应正确管理使能信号,避免总线冲突。
  • 虽然器件具备 32 mA 驱动能力,但建议在驱动较大电容或低阻负载时评估功耗与瞬态电流,必要时外加缓冲或限流电路。
  • 传播延迟规范通常在特定载荷(CL=15 pF)和电压下给出,实际延迟会随负载和供电电压变化,请在高速设计中按实际条件验证时序裕量。

五、封装与可靠性

SC-70-6 超小型封装利于高密度 PCB 布局,适合空间受限的消费电子与工业控制产品。器件工作温度覆盖工业级范围(-40 ℃ ~ +125 ℃),适应更严苛的环境要求。静态电流低,有利于长时间待机或电池供电设计。

六、选型参考

选择 74LVC1T45XC6G/TR 的典型理由:

  • 需要在 1.65V~5.5V 宽电压域间无缝互连;
  • 要求低静态功耗且具备三态控制以便总线管理;
  • 受限空间需小封装且需一定输出驱动能力(32 mA);
  • 对工业级温度和中高速传输(tpd≈5 ns@5V, CL=15 pF)有需求。

总结:74LVC1T45XC6G/TR 以其宽电压适应性、低功耗、小体积与三态控制特性,适合作为单通道双向电平转换解决方案,在嵌入式、消费电子与工业控制等领域可提供可靠的信号互通能力。在具体设计中,请结合实际信号幅值、负载电容与总线管理策略进行验证与布局优化。

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