Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SGMICRO SGM706-SYS8G/TR SGM706
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SGMICRO SGM706-SYS8G / TR
- Type
- SGMICRO
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SGMICRO
- Electronic Component
- SGM706-SYS8G/TR
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- Supervisorand positions IC
- Electronic Component
- 0.197g
- Electronic Component
- 1
- Features
- positions; Gate
- Electronic Component
- BM0093065415
- Reset
- 200ms
- Operating Temperature
- 40℃~+85℃@(TA)
- Operating Voltage
- 1V~5.5V
- ICType
- Voltage Supervisor
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SGM706-SYS8G/TR 监控和复位芯片
一、产品简介
SGM706-SYS8G/TR 是由知名品牌 SGMICRO（圣邦微）推出的一款高性能监控和复位芯片，采用了SOIC-8封装，适用于各种电子设备中的电源监控应用。其工作电压范围为2.93V，具有低电平有效的特点，能够在电压低于设定值时发送复位信号，从而保障系统的稳定性和可靠性。
二、主要功能
监控功能: SGM706 系列通过精确的电压监测能够实时监控电源电压。当电压下降到特定下限（2.93V）时，芯片会立即检测到并触发复位信号，以保护后续电路不受电压不稳定的影响。
复位功能: 一旦监测到电压低于设定值，SGM706会输出低电平信号，从而复位系统，防止系统在低电压状态下运行而可能导致的数据错误或硬件损坏。
快速响应: 该芯片具有快速的响应时间，这使得它可以在电源电压异常时迅速作出反应，及时发出复位指令，从而最大程度地降低潜在风险。
低功耗设计: SGM706-SYS8G/TR 采用了低功耗设计，适合于各种对能耗有严格要求的便携式产品。
简单的接口格式: SOIC-8 封装使 SGM706 具有较小的体积和简单的电路接口，便于嵌入到各种电子设备中，方便应用于空间受限的场合。
三、应用领域
SGM706-SYS8G/TR 监控和复位芯片广泛应用于许多不同的领域，包括但不限于以下几种：
- 消费电子: 在智能手机、平板电脑、可穿戴设备等中，保护系统在电池电量不足时不出现异常工作。
- 工业控制: 适合在自动化设备和工业传感器中使用，确保设备在电源波动时能够安全运行。
- 汽车电子: 用于汽车中的电源管理系统，确保在电压不足时，整车电子系统能够进行有效复位，避免事故。
- 通信设备: 在路由器、电信基站等设备中，用于监控电源状态，保障稳定的通信信号传输。
四、技术规格
- 封装形式: SOIC-8
- 监测电压: 2.93V
- 电源电压范围: 2.5V - 5.5V
- 低电平有效: 支持低电平有效的复位输出
- 工作温度: -40℃至 +85℃
- 静态功耗: 典型值一般低于1µA，适配超低功耗设备
五、优势与特点
SGM706-SYS8G/TR 具备多项优势，使其在众多监控和复位芯片中脱颖而出：
- 高可靠性: 其设计符合严苛的工业标准，确保长期的稳定性。
- 优异的性能: 能够在较宽的温度范围内稳定工作，并提供精准的电压监控。
- 广泛的兼容性: 可与多种微控制器及电源管理IC兼容，方便设计者进行集成与使用。
六、结论
总之，SGM706-SYS8G/TR 监控和复位芯片是为确保电子设备在电压波动或电源故障情况下保持稳定和可靠的重要元件。其出色的功能、高可靠性和广泛的应用场景使其成为众多电子设计师的优选方案。无论是在消费类电子产品、工业控制，还是在汽车电子和通信设备中，SGM706-SYS8G/TR 都能够有效提升系统的稳定性和安全性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
