Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SGM8199A0XC6G/TR是由中国知名的模拟集成电路供应商SGMICRO(圣邦微)推出的一款高性能运算放大器(OP Amp)。该产品采用先进的SC70-6封装,适合各种空间有限的应用场合。其出色的电气性能和小型封装使其成为各种电子设备中不可或缺的重要元器件。
低功耗设计:SGM8199A0XC6G/TR实现了微瓦级的功耗,特别适合需要长时间运行而又对电源续航有严格要求的便携式设备。
宽电源电压范围:该运算放大器支持广阔的电源电压范围(通常为1.8V到5.5V),使其能够适应不同的应用场景,并可以与多种电源系统兼容。
高增益带宽积:SGM8199A拥有良好的增益带宽特性,常用于高频信号处理。其增益带宽积可达到几 MHz,使其能够高效处理快速变化的信号。
低输入偏置电流:此产品的输入偏置电流非常低,通常在纳安级别,适合需要高精度信号采样的应用,比如传感器接口和数据采集系统。
高输入阻抗与低输出阻抗:确保信号转换过程中最小干扰和衰减,提升信号传输效率。
出色的共模抑制比(CMRR)和电源抑制比(PSRR):良好的CMRR和PSRR特性确保了运算放大器在各种环境干扰下依然能保持稳定性,适合高精度的信号处理应用。
SGM8199A0XC6G/TR广泛应用于多个领域,包括但不限于:
便携式电子设备:如智能手机、平板电脑、数码相机等,由于其低功耗的特性,非常适合使用在电池供电的设备上。
传感器接口:在各类传感器(如温度传感器、压力传感器等)的信号处理环节中,SGM8199A能够精准放大微弱信号,提高测量精度。
音频设备:用于音频信号的增益调整和处理,使其能够在不同的音频频率下保持高 fidelity。
医疗设备:如心电图(ECG)仪器等,能够在保证信号完整性的同时,提供高精度、高可靠性的信号放大功能。
工业控制系统:其精度和稳定性在众多工业设备的信号解读和控制中发挥着重要作用。
SGM8199A0XC6G/TR采用SC70-6封装,封装尺寸极小(约为2.0mm x 2.0mm x 0.75mm),使得在电路板设计中能够节省宝贵的空间,特别适合高密度排列的电子产品。其引脚布局也经过精心设计,确保简便的PCB布线。
SGM8199A0XC6G/TR是一个综合性能卓越的运算放大器,凭借其独特的技术优势及高可靠性,在多个应用领域都表现出了极高的适用性与灵活性。无论是对低功耗、高精度有需求的便携式设备,还是对信号放大有精准要求的工业设备,SGM8199A0XC6G/TR都是一个理想的选择。其提供的高性能和稳定性,为设计师的电路方案提供了更为广泛的可能性,是现代电子设计中值得信赖的组件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products