Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称: CL10B223KB8NNNC
品牌: SAMSUNG (三星)
封装类型: 0603
CL10B223KB8NNNC 是一款具有低电容值和高可靠性的多层陶瓷电容,广泛应用于各种电子设备中,其重要的电气性能和物理特性使其成为多个设计的理想选择。此电容值为 22nF,适合在高频信号处理中使用。它的额定电压为50V,能够满足大多数应用的电压需求。
高稳定性:X7R温度系数的设计确保了电容在宽温度变化下的稳定性,适合在-55°C 到 125°C 的极限工作温度范围内使用。这种特性非常适合汽车、工业控制和其他需要高可靠性的应用。
表面安装:0603 封装类型使得该电容可以轻松集成到现代电子电路中,尤其适合于自动化贴片生产线。在空间有限的设计中,较小的尺寸使其能够放置在密集排列的电路板上,降低了组件占用的空间。
低电压降和高频响应:该型号电容能够有效抑制高频噪声,提供优良的滤波效果,使其在无线通信、音频设备和精密测量中表现优异。
CL10B223KB8NNNC 广泛应用于各类电子设备,例如:
消费电子产品:如手机、平板电脑和笔记本电脑可利用该电容的高稳定性和低噪声特性,提升设备对电源波动的抵御能力。
汽车电子:在各类汽车传感器、控制模块中,该电容可确保在极端温度条件下的可靠性能,从而保证行车安全。
工业设备:如工控机和信号处理设备中,该电容能够有效过滤和稳定电源,确保设备持久性和稳定性。
医疗设备:在要求高度可靠的医疗监测和诊断设备中,CL10B223KB8NNNC能够确保设备在各种环境下的高性能。
长期稳定性:得益于 X7R 的温度系数,能在多种应用环境中保持良好的性能,适合长期使用。
降低信号干扰:在需要稳定信号和低电噪声的场合,使用该电容能够有效降低信号干扰并提升系统整体性能。
可耐受高电压:50V 的额定电压使其可以在相对苛刻的环境中工作,减少了因过电压导致的故障风险。
CL10B223KB8NNNC 贴片电容是一款稳定性高、适用范围广的电子元器件,其卓越的特性能够满足各种应用需求。通过其出色的电气性能和小巧的封装设计,该电容在制造高质量电子产品中起着至关重要的作用,适合各类高技术领域的应用。无论您是在设计新产品还是替换旧元件,CL10B223KB8NNNC 都是一个值得信赖的选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products