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产品名称: CL21A226MPQNNNE
品牌: SAMSUNG (三星)
封装类型: 0805(2012公制)
安装类型: 表面贴装 (MLCC)
电容值: 22µF
电压额定值: 10V
容差: ±20%
尺寸: 2.00mm × 1.25mm(长 × 宽)
最大厚度: 1.35mm
工作温度范围: -55°C ~ 85°C
温度系数: X5R
CL21A226MPQNNNE 是一种高性能的贴片多层陶瓷电容器(MLCC),由知名电子元器件制造商三星(SAMSUNG)出品。此款电容器采用0805(2012公制)封装,结合了紧凑的尺寸与出色的电性能,适用于多种电子应用领域。
电容值与电压: CL21A226MPQNNNE 的电容额定值为22μF,电压额定值达到10V,使其在多种电路设计中能够提供稳定的电压支持。其高电容值特别适用于需要局部存储电能的电路,如去耦、滤波或暂态电源应用。
温度系数与性能: 该电容器使用了X5R温度系数,意味着其电容值在-55°C至85°C的温度范围内保持相对稳定。这一点对于那些在严苛的环境下工作或对温度变化敏感的电气设备尤其重要。
有效的尺寸和安装类型: 其0805封装尺寸为2.00mm × 1.25mm,厚度最大为1.35mm,适合现代小型化PCB(印刷电路板)设计。表面贴装的设计允许自动化安装,有效降低生产成本。
容差: CL21A226MPQNNNE的容差为±20%,提供了灵活的设计选择,使其能够适应不同的电路需求。
CL21A226MPQNNNE广泛应用于多种电子设备中,包括但不限于:
CL21A226MPQNNNE 作为一款性能出色的表面贴装多层陶瓷电容器,凭借其22µF的电容、10V的额定电压和-55°C至85°C的宽温工作范围,成为消费电子、工业设备、汽车电子及医疗设备等领域的理想选择。三星(SAMSUNG)的品牌保证了其可靠性与稳定性,是电子设计师在选择高性能、电气稳定组件时的优选之一。
凭借其紧凑的尺寸和强大的性能,CL21A226MPQNNNE的设计实现了高效率和小型化的理念,为现代电子产品的发展提供了强有力的支持。无论在高温环境下的应用还是要求精密的信号分析中,该电容器均能体现出其卓越的适应性和性能优势。
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