WMSIC Electronic Components

CL05A475MO5NUNC

ModelCL05A475MO5NUNC
Package0402
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL05A475MO5NUNC
Type
SAMSUNG
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL05A475MO5NUNC
Electronic Component
1
Electronic Component
4.7uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM69413963
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL05A475MO5NUNC

CL05A475MO5NUNC 是一款由三星(SAMSUNG)生产的高性能多层陶瓷电容器(MLCC),其具备4.7µF的电容值和16V的额定电压。该电容器特别设计用于表面贴装,符合0402封装规格(1005公制),广泛应用于各种电子设备的电源和信号路径中,以提供良好的电气特性和稳定性能。

关键技术参数

  1. 电容值和容差:

    • 电容:4.7µF
    • 容差:±20% 这种容差范围为设计提供了足够的灵活性,可以适应不同应用中的电容需求。
  2. 电压额定值:

    • 额定电压:16V 在较高电压情况下工作,这使得CL05A475MO5NUNC适合多种现代电子电路应用,比如DC-DC转换器和滤波电路。
  3. 温度系数:

    • 类型:X5R X5R温度系数的电容器特性表明其电容值在-55°C至85°C的工作温度范围内保持稳定。因此,它适用于恶劣环境和温度变化大的应用。
  4. 工作温度范围:

    • 温度范围:-55°C至85°C 这一特性使得该电容器适合汽车电子、工业设备及其他苛刻环境的应用,确保在温度变化较大的情况下依然可靠工作。
  5. 封装与尺寸:

    • 封装/外壳:0402 (1005 公制)
    • 尺寸:0.039" 长 x 0.020" 宽(1.00mm x 0.50mm),最大厚度:0.022"(0.55mm) 这种超小型封装使得该电容器非常适用于空间受限的设计,如智能手机、平板电脑及其他便携式设备。0402封装的尺寸使其易于在现代高密度电路板中布局。

应用领域

CL05A475MO5NUNC适用的应用场景非常广泛,包括但不限于以下几个方面:

  1. 消费电子:如智能手机、平板电脑、穿戴设备等,在这些设备中,电容器的体积小、容量大、性能稳定是十分重要的。

  2. 汽车电子:随着汽车电子化程度的提高,机器的稳定性和耐环境性变得尤为重要;该电容器具备高温和低温性能,使其适合用在电源管理和信号处理电路中。

  3. 工业控制:在工业自动化和控制系统中,保证元器件在恶劣环境下可靠工作是关键,CL05A475MO5NUNC能够满足这些要求。

  4. 网络设备和通信:在各种网络设备和通信模块中,稳定的电源和信号的去耦至关重要,4.7µF的电容可以有效滤除高频噪声和提供瞬态电流。

性能优势

采用先进的陶瓷材料和多层结构设计,CL05A475MO5NUNC电容器在提供高电容值的同时,确保极低的ESR(等效串联电阻)和ESL(等效串联电感),这使得它在高频应用中表现更加出色。电容器的稳定性和可靠性也得益于其优质的制造工艺,保证在各种操作条件下的长寿命和高稳定性。

总结

CL05A475MO5NUNC是一款性能卓越、高度集成的MLCC电容器,提供了4.7µF的版图,适合现代电子设备中的高效能应用。其超小的0402封装、出色的温度表现以及优秀的电气性能,使其成为一款理想的选择,满足日益增长的技术需求和应用挑战。无论是消费电子、汽车电子还是工业控制领域,CL05A475MO5NUNC都能够提供稳定和可靠的电源和信号处理解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.