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CL03A104KQ3NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL03A104KQ3NNNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL03A104KQ3NNNC
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0227676714
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL03A104KQ3NNNC 产品概述
一、产品简介
CL03A104KQ3NNNC 是三星（SAMSUNG）系列的贴片多层陶瓷电容（MLCC），标称容值 100nF（0.1µF），容差 ±10%，额定电压 6.3V，介质类型为 X5R，封装为 0201。该型号适用于对体积、布局密度有严格要求的便携式电子设备和高密度 PCB 设计，常用于电源去耦、旁路和噪声抑制。
二、主要参数
- 容值：100nF（0.1µF）
- 容差：±10%
- 额定电压：6.3V
- 介质：X5R（工作温度范围及介电稳定性按 X5R 标准）
- 封装：0201（超小贴片）
- 品牌：SAMSUNG
三、特性与优势
- 小体积、高密度：0201 封装适合空间受限的应用，可显著提高 PCB 布局密度。
- 电气性能：X5R 在中等温度范围内保持较好的电容稳定性，适合常温电源去耦。
- 低 ESR/ESL：多层陶瓷结构带来较低的等效串联电阻和电感，有利于高频滤波。
- 工艺兼容：适用于常规回流焊流程，便于自动化贴装。
四、应用场景
- 手机、平板、可穿戴设备等便携终端电源滤波/去耦
- 高密度主板、模块化电源线路旁路
- 射频前端、模拟电路的局部解耦（需关注 DC bias 与频率特性）
五、PCB 设计与焊接建议
- 靠近电源引脚布局以最小化回路面积，减小寄生电感。
- 对于关键去耦，建议并联多种容值（如 100nF 与 1µF/10µF）以覆盖更宽频率范围。
- 0201 封装对贴装精度要求高，采用精确的锡膏印刷和真空取放以减少偏位和损伤。
- 遵循厂商推荐的焊盘尺寸与焊接温度曲线，避免过热或机械应力集中。
六、使用注意与可靠性
- X5R 属高介电常数陶瓷，存在明显的 DC 偏压效应：在接近额定电压时有效电容可能显著下降，设计时应参考厂方 DC bias 曲线并留出裕量。
- 温度特性：X5R 在 -55°C 至 +85°C 范围内电容变化受限于规范（典型 ±15%）；实际应用请验证温漂对电路的影响。
- 机械脆性：陶瓷易碎，避免在贴装、返修或热循环过程中产生过大弯曲、冲击或拉伸。
- 采购与验证：批量使用前建议获取并审阅三星官方数据手册与可靠性测试报告，必要时进行样片验证（温度循环、湿热、焊接可靠性、电压偏置测试等）。
如需更详细的电气特性曲线（频率响应、等效串联参数、DC bias 曲线）或封装尺寸图，请提供以便从厂家数据手册中提取精确参数。
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