Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL05B102KB5VPNC
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05B102KB5VPNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05B102KB5VPNC
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0257686736
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05B102KB5PNC 产品概述
1. 产品简介
CL05B102KB5PNC 是一款由三星（SAMSUNG）生产的表面贴装多层陶瓷电容器（MLCC），属于汽车级电子元器件。该电容器符合AEC-Q200标准，适用于严苛的汽车电子环境。其封装尺寸为0402（1005公制），具有高可靠性和优异的电气性能，广泛应用于汽车电子、工业控制、通信设备等领域。
2. 主要特性
- 安装类型：表面贴装（SMD）
- 封装尺寸：0402（1005公制），具体尺寸为0.039" 长 x 0.020" 宽（1.00mm x 0.50mm）
- 厚度：最大厚度为0.022"（0.55mm）
- 电容值：1000pF（1nF）
- 容差：±10%
- 额定电压：50V
- 温度系数：X7R，表示在-55°C至+125°C温度范围内，电容值变化不超过±15%
- 工作温度范围：-55°C ~ 125°C
- 等级：符合AEC-Q200标准，适用于汽车级应用
3. 应用领域
CL05B102KB5PNC 电容器广泛应用于以下领域：
- 汽车电子：用于发动机控制单元（ECU）、车身控制模块（BCM）、信息娱乐系统、传感器等。
- 工业控制：用于PLC、工业自动化设备、电机控制等。
- 通信设备：用于基站、路由器、交换机等通信基础设施。
- 消费电子：用于智能手机、平板电脑、笔记本电脑等便携式设备。
4. 产品优势
- 高可靠性：符合AEC-Q200标准，确保在严苛的汽车环境中稳定工作。
- 小型化设计：0402封装尺寸，适合高密度PCB设计，节省空间。
- 宽温度范围：工作温度范围为-55°C至125°C，适应各种环境条件。
- 优异的电气性能：X7R温度系数，确保在宽温度范围内电容值稳定。
5. 技术参数
| 参数名称 | 参数值 |
|---|---|
| 安装类型 | 表面贴装（SMD） |
| 封装尺寸 | 0402（1005公制） |
| 尺寸 | 1.00mm x 0.50mm |
| 厚度 | 0.55mm |
| 电容值 | 1000pF（1nF） |
| 容差 | ±10% |
| 额定电压 | 50V |
| 温度系数 | X7R |
| 工作温度范围 | -55°C ~ 125°C |
| 等级 | AEC-Q200 |
6. 使用注意事项
- 焊接条件：建议使用回流焊工艺，焊接温度曲线应符合IPC/JEDEC J-STD-020标准。
- 存储条件：应存放在干燥、无尘的环境中，避免高温和高湿。
- 电气应力：避免超过额定电压和最大工作温度，以防止电容器损坏。
7. 结论
CL05B102KB5PNC 是一款高性能、高可靠性的表面贴装多层陶瓷电容器，适用于汽车电子、工业控制、通信设备等领域。其小型化设计、宽温度范围和优异的电气性能，使其成为各种电子设备的理想选择。符合AEC-Q200标准，确保在严苛的汽车环境中稳定工作，是工程师设计高可靠性电子产品的首选元件。
通过以上概述，您可以全面了解CL05B102KB5PNC电容器的特性、应用和优势，为您的设计提供可靠的元器件支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
