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CL05C080DB51PNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- SAMSUNG CL05C080DB51PNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05C080DB51PNC
- Electronic Component
- 1
- Electronic Component
- 8pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0257686735
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05C080DB51PNC 产品概述
一、产品简介
CL05C080DB51PNC 为 SAMSUNG（三星）品牌的贴片多层陶瓷电容（MLCC），额定容量 8pF，额定电压 50V，介质材质为 C0G（又称 NP0）。封装尺寸为 0402（约 1.0 × 0.5 mm），适用于对容量稳定性与低损耗有严格要求的小型化电路设计。
二、主要性能与特点
- 容量：8pF，适用于高频与精密滤波场合。
- 额定电压：50V，满足常见射频与模拟电路的工作电压需求。
- 温度系数：C0G/NP0，温度稳定性优良，典型温漂接近 0 ppm/°C（属一类温度特性），适合时基、振荡器与高 Q 值电路。
- 损耗小、品质因数高，能在射频前端与谐振回路中保持良好性能。
- 小型 0402 封装，适合高密度贴片与轻薄化产品。
三、典型应用
- 射频匹配网络、调谐与滤波电路（天线匹配、射频滤波器）。
- 晶振与振荡器负载电容、相位锁定环（PLL）元件。
- 精密模拟电路、采样与定时电路中的耦合或旁路元件（在低容量需求场景）。
- 移动设备、可穿戴设备、物联网终端等体积受限的电子产品。
四、封装与焊接
- 0402 贴片封装，通常以卷带（tape & reel）方式供货，便于贴片机装配。
- 建议采用推荐的回流焊工艺（符合 JEDEC/IPC 曲线），控制峰值温度与加热速率以避免热应力和裂纹。
- 焊盘设计应考虑应力释放，避免 PCB 弯曲或硬性焊点引起元件破裂。
五、选型与注意事项
- 若电路对温度稳定性与频率特性要求极高，C0G 是优先选型。
- 0402 尺寸虽然节省空间，但对手工焊接和机械强度要求较高，装配及检修需注意。
- 小电容在高频下可能接近自谐频率，设计时应评估寄生电感/电阻对电路的影响。
- 存储与搬运避免强烈振动和弯曲，防止机械性破损。
六、可靠性与合规
- MLCC 本身耐久性高，常规应用下长期可靠。建议参考厂家数据手册的加速寿命和温度循环测试数据以满足产品认证需求。
- 通常符合 RoHS 等环保要求，具体合规文件可向供应商索取。
如需更详细的电气参数（容差、等效串联电阻 ESR、自谐频率、回流焊曲线及包装信息），建议参阅三星官方规格书或向授权分销商获取原厂资料。
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