WMSIC Electronic Components

CL05C101JB51PNC

ModelCL05C101JB51PNC
Package0402
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL05C101JB51PNC
Type
SAMSUNG
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL05C101JB51PNC
Electronic Component
1
Electronic Component
100pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0264210138
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL05C101JB51PNC 产品概述

1. 产品简介

CL05C101JB51PNC 是一款由三星(SAMSUNG)生产的表面贴装多层陶瓷电容(MLCC),适用于汽车级应用。该电容具有高可靠性和稳定性,符合AEC-Q200标准,能够在极端温度环境下保持优异的性能。

2. 主要参数

  • 安装类型: 表面贴装(SMD)
  • 封装尺寸: 0402(1005 公制),具体尺寸为0.039" 长 x 0.020" 宽(1.00mm x 0.50mm)
  • 厚度(最大值): 0.022"(0.55mm)
  • 电容值: 100pF
  • 容差: ±5%
  • 额定电压: 50V
  • 温度系数: C0G,NP0
  • 工作温度范围: -55°C ~ 125°C
  • 等级: AEC-Q200

3. 应用领域

CL05C101JB51PNC 主要应用于汽车电子系统,包括但不限于:

  • 发动机控制单元(ECU)
  • 车载信息娱乐系统
  • 车身电子控制系统
  • 安全系统(如ABS、ESP等)
  • 传感器模块

4. 产品特点

  • 高可靠性: 符合AEC-Q200标准,确保在汽车应用中的高可靠性和长寿命。
  • 稳定性: C0G(NP0)温度系数,确保在宽温度范围内电容值稳定。
  • 小型化: 0402封装尺寸,适合高密度PCB设计,节省空间。
  • 高耐压: 额定电压50V,适用于多种汽车电子应用。
  • 宽工作温度范围: -55°C ~ 125°C,适应汽车环境中的极端温度变化。

5. 技术细节

  • 电容介质: 多层陶瓷结构,提供优异的电气性能。
  • 电极材料: 采用高导电性材料,确保低ESR(等效串联电阻)和低ESL(等效串联电感)。
  • 焊接兼容性: 适用于回流焊和波峰焊工艺,易于自动化生产。

6. 质量与认证

  • AEC-Q200认证: 符合汽车电子委员会(AEC)的Q200标准,确保产品在汽车应用中的高可靠性。
  • RoHS合规: 符合欧盟RoHS指令,限制有害物质的使用,环保安全。

7. 包装与存储

  • 包装形式: 通常以卷带形式提供,便于自动化贴装。
  • 存储条件: 建议存储在干燥、无尘的环境中,避免高温和湿度。

8. 使用建议

  • PCB设计: 在PCB设计时,建议遵循0402封装的焊盘设计规范,确保焊接质量。
  • 焊接工艺: 推荐使用回流焊工艺,确保焊接可靠性和一致性。
  • 温度管理: 在高温应用中,建议进行热管理,避免电容过热影响性能。

9. 市场定位

CL05C101JB51PNC 是一款专为汽车电子设计的高性能MLCC,适用于对可靠性和稳定性要求极高的应用场景。其小型化设计和宽工作温度范围使其成为汽车电子系统中的理想选择。

10. 总结

CL05C101JB51PNC 是一款由三星生产的高可靠性、高稳定性的表面贴装多层陶瓷电容,专为汽车电子应用设计。其符合AEC-Q200标准,具有C0G(NP0)温度系数和宽工作温度范围,适用于多种汽车电子系统。其小型化设计和优异的电气性能使其在汽车电子领域中具有广泛的应用前景。

通过以上概述,可以看出CL05C101JB51PNC 是一款性能卓越、应用广泛的汽车级MLCC,能够满足汽车电子系统对高可靠性和稳定性的严格要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.