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CL05X106MR5NUNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05X106MR5NUNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05X106MR5NUNC
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0000259628
- Electronic Component
- X6S
- Voltage
- 4V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL05X106MR5NUNC 贴片电容
简介
CL05X106MR5NUNC是由三星(SAMSUNG)公司生产的一种表面贴装多层陶瓷电容器(MLCC)，其封装尺寸为0402（1.00mm x 0.50mm），是一款具有广泛应用的电子元器件。凭借其出色的电容特性和稳定的工作性能，CL05X106MR5NUNC成为了众多电子电路设计中的理想选择，适合各类消费电子、工业设备、通信设备等场景。
产品特点
电容值与容差：该电容的额定电容值为10µF，容差为±20%，能够满足多种电路中对电容值的要求，同时提供一定程度的容差以适应实际应用中的变化。
工作电压：CL05X106MR5NUNC具有4V的额定工作电压，能够在多个电路环境下安全可靠地运行。确保在此电压范围内使用，可以有效防止电容失效或损坏。
温度性能：该电容的工作温度范围为-55°C至105°C，适合于更宽的温度场景。这使得它能够在严苛环境中使用，特别是汽车电子、工业自动化等应用领域。
温度系数：该产品采用了X6S温度系数，具有较好的温度稳定性。X6S电容在较宽的温度范围内保持电容值的稳定性，与其他温度系数的电容相比，表现出较小的温度系数变化。
封装设计：0402（1005 公制）的封装尺寸使得CL05X106MR5NUNC在PCB板上占据的空间较小，适用于高密度布线设计的电子产品。受益于其表面贴装特性，该元器件可以迅速安装和焊接，提高生产效率。
应用场景
CL05X106MR5NUNC电容可广泛应用于多种电子设备中，具体示例如下：
消费电子：如智能手机、平板电脑和笔记本电脑等设备中，用于滤波、耦合、旁路等电路中，优化电源和信号质量。
工业设备：在自动化控制系统中，MLCC电容能有效地抑制电磁干扰，提高信号的稳定性与可靠性。
通信设备：在无线通讯基站和相关设备中，该电容有助于信号整形、旁路和电源管理，确保设备在各种环境条件下的稳定运行。
汽车电子：由于其优良的温度性能，CL05X106MR5NUNC适用于车载电子系统，包括导航、娱乐和控制系统，能够承受车内变化的温度和电压。
总结
CL05X106MR5NUNC是一款高性能、可靠的表面贴装多层陶瓷电容器，结合了小巧的封装、优异的电气特性和广泛的应用适用性。无论是在消费电子、工业设备、通信设备还是汽车电子领域，其卓越的性能使其成为电路设计师和工程师首选的元器件之一。随着电子设备不断向小型化、高性能的方向发展，CL05X106MR5NUNC贴片电容契合了市场对高可靠性和小型化元器件的需求，是未来电子电路设计的重要组成部分。
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