WMSIC Electronic Components

CL05C2R7CB51PNC

ModelCL05C2R7CB51PNC
Package0402
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SAMSUNG CL05C2R7CB51PNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL05C2R7CB51PNC
Electronic Component
1
Electronic Component
2.7pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0257686752
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL05C2R7CB51PNC 产品概述

一、产品简介

CL05C2R7CB51PNC 为三星(SAMSUNG)生产的一款多层陶瓷电容(MLCC),封装为 0402(约 1.0 mm × 0.5 mm)。容值 2.7 pF,额定电压 50 V,温度系数为 C0G/NP0。该系列定位于高稳定性、低损耗的小容值元件,适用于对频率稳定性、低温漂和低介质损耗有严格要求的电子系统。

二、主要规格

  • 容值:2.7 pF
  • 额定电压:50 V DC
  • 温度特性:C0G/NP0(近零温度系数,温漂极小)
  • 封装:0402(常用贴片微型封装)
  • 工作温度范围:常见 -55 ℃ 至 +125 ℃(具体以厂家资料为准)
  • 品牌:SAMSUNG(三星)

三、关键特性

  • 温度稳定性好:C0G/NP0 材料在工作温度范围内电容值几乎不随温度变化,适合精密滤波和频率控制电路。
  • 低损耗、低介质吸收:对高频信号影响小,Q 值高,适用于射频前端、振荡器及高精度计时电路。
  • 小体积、高可靠性:0402 封装便于高密度 PCB 布局,同时具备陶瓷电容固有的可靠性。
  • 良好的工艺兼容性:适应常规无铅回流工艺,便于 SMT 生产线集成。

四、典型应用

  • 射频电路:谐振、匹配网络、滤波和耦合
  • 振荡器与时钟电路:保持频率稳定性与相位噪声性能
  • 高速数据通路与模拟前端:旁路与去耦(小容值组合使用)
  • 精密测量与采样系统:减少温漂对测量精度的影响

五、设计与布局建议

  • 布局时尽量靠近信号源或器件引脚,缩短走线,减小寄生电感与寄生电容。
  • 使用推荐的 PCB 焊盘尺寸,避免过大或过小焊盘引起焊接问题或机械应力集中。
  • 对于关键射频节点,注意地平面完整性与回流路径,避免长走线引入寄生效应。
  • 拆装与手工焊接时注意加热时间与温度,避免热冲击导致陶瓷裂纹。

六、可靠性与工艺注意

  • MLCC 为脆性元件,机械应力(弯曲、振动、强力点按)易导致微裂纹,从而影响电性能与可靠性。
  • 储存时建议保持原包装,避免潮湿与外力冲击;若长时间暴露于潮湿环境,应按回流前进行干燥处理。
  • 推荐遵循 PCB 设计的应力缓解(如在器件下方避免通孔、控制焊盘尺寸)以及标准回流曲线(以厂家推荐为准)。

七、采购与替代说明

CL05C2R7CB51PNC 为通用的小容值 C0G MLCC,若需更高电压或不同封装可在同系列或其他厂商中寻找等效型号,注意比较温漂、封装尺寸与额定电压等关键参数以确保互换性。采购时建议向供应商索取完整规格书与可靠性测试报告以确认应用要求。

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