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CL05B332KB5VPNC
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05B332KB5VPNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05B332KB5VPNC
- Electronic Component
- 1
- Electronic Component
- 3.3nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0262576576
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05B332KB5VPNC 产品概述
一、产品简介
CL05B332KB5VPNC 是三星（SAMSUNG）生产的一款贴片多层陶瓷电容（MLCC），额定电压 50V，标称容量 3.3nF，公差 ±10%（K），介质材料为 X7R，封装尺寸为 0402（公制 1005）。该型号针对体积受限、性能稳定的去耦、滤波和耦合应用进行优化，适用于各类消费电子与工业电子产品。
二、主要参数
- 容值：3.3nF（332）
- 精度：±10%（K）
- 额定电压：50V DC
- 温度特性：X7R（工作温度范围 -55°C 至 +125°C，温度引起的电容变化在规范范围内）
- 封装：0402（1005）表面贴装
- 品牌：SAMSUNG（三星）
三、特性与优势
- 体积小、容量稳定：0402 小封装有利于高密度布板与空间受限设计。
- X7R 介质在宽温度范围内具有较好的电容稳定性，适合一般电源去耦与滤波场景。
- 低等效串联电阻（ESR）与低寄生电感（ESL），在中高频下表现良好。
- 符合无铅／RoHS 要求，工艺成熟、供应链稳定。
四、典型应用
- 电源去耦与旁路（PCB 电源平滑）
- 模拟滤波与耦合电路
- 高频旁路、射频前端（非高精度频率确定电容）
- 移动终端、物联网设备、消费电子、工业控制模块等体积受限的产品
五、设计与使用建议
- DC Bias：X7R MLCC 在工作电压下存在电容随偏压下降的现象，设计时应留有裕量或通过实验验证实际工作容量。
- 版图布局：去耦时尽量靠近被去耦器件的电源脚，焊盘与连线尽量短而粗，必要时做地与电源的过孔针刺（via stitching）。
- 机械应力：0402 尺寸对基板弯曲与焊接冷却收缩较敏感，避免芯片处于板边或受机械应力位置，回流焊工艺按厂商推荐曲线执行。
- 存储与装配：建议按供应商包装（Tape & Reel）和储存条件保存，避免潮湿高温环境，焊接前遵循回流次数及温度限制。
六、可靠性与采购信息
CL05B332KB5VPNC 属于工业级通用型 MLCC，制造商具有严格的生产与质量控制流程，良好的一致性与可替换性。具体的封装厚度、温度曲线、焊接规范和包装形式（卷带盘量、最小订购量）请参阅三星官方datasheet或向供应商确认以获得最终设计与采购资料。
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