Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05B105KQ5NQNC 是由三星电子机械(Samsung Electro-Mechanics)制造的多层陶瓷电容器(MLCC),属于CL系列。这个产品是广泛应用于现代电子设备中的关键组件,特别适用于需要高可靠性和紧凑设计的场景。
CL05B105KQ5NQNC 采用高质量的陶瓷介质和先进的制造工艺,确保其在各种环境条件下都能保持稳定的性能。其X7R温度系数意味着在-55°C到125°C的广泛温度范围内,电容值仅会有±15%的变化,这使得它非常适合用于需要高可靠性的应用。
该电容器采用0402(1005 公制)的封装,尺寸为1.00mm x 0.50mm x 0.55mm。这使得它非常适合用于空间有限但要求高性能的电子设备,如智能手机、平板电脑、汽车电子系统等。
CL05B105KQ5NQNC 因其通用性而广泛应用于各种电子设备中。它可以用于滤波、耦合、旁路等多种电路设计中,帮助稳定电源、减少噪音和提高系统整体性能。
作为一个表面贴装组件,CL05B105KQ5NQNC 可以通过自动化生产流程进行安装,这不仅提高了生产效率,也减少了手工操作带来的错误率。这种封装方式还能提高组件的机械强度和抗振性。
该电容器的额定电压为6.3V,容量为1µF。这种组合使得它在许多中低压应用中都能找到用武之地,比如在电源滤波、信号处理和存储器旁路等场景中。
±10% 的容差保证了该电容器在实际使用中能够保持较好的稳定性和一致性。这对于那些对电容值精度有较高要求的应用来说尤为重要。
-55°C ~ 125°C 的工作温度范围使得 CL05B105KQ5NQNC 可以在极端环境下正常运作,这对于汽车电子、工业控制和航空航天等领域具有重要意义。
在安装过程中,应确保表面清洁无污染,并使用适当的焊接温度和时间,以避免损坏组件。建议参考制造商提供的详细安装指南。
CL05B105KQ5NQNC 可以应用于以下几个领域:
CL05B105KQ5NQNC 是一款高性能、紧凑设计的多层陶瓷电容器,适用于广泛的电子应用场景。其优异的技术规格、广泛的工作温度范围和高可靠性,使其成为现代电子设计中的重要组件。通过选择这个产品,工程师们可以确保他们的设计具有卓越的性能和可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products