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CL05B153KB5VPNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05B153KB5VPNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05B153KB5VPNC
- Electronic Component
- 1
- Electronic Component
- 15nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0257686741
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05B153KB5VPNC 产品概述
一、产品简介
CL05B153KB5VPNC 是三星（SAMSUNG）生产的多层陶瓷电容器（MLCC），额定容量为 0.015µF（15nF），初始容差 ±10%，额定电压 50V，介质类型为 X7R，封装为 0402（1005 公制，约 1.0 × 0.5 mm）。该器件定位为通用型去耦、旁路与滤波应用，兼顾体积小与电气性能稳定。
二、主要规格
- 容值：15nF（0.015µF）
- 初始容差：±10%
- 额定电压：50V DC
- 介质：X7R（温度范围 -55℃ 至 +125℃，随温度变化在规范内）
- 封装：0402（1005 公制）
- 品牌：SAMSUNG（三星）
- 适用回流：无铅回流工艺兼容（请参照厂家回流曲线）
三、性能特点
- 体积小，适合高密度贴装：0402 封装可在空间受限的移动设备、便携电源板上节省布局面积。
- 温度特性可靠：X7R 介质在 -55℃ ~ +125℃ 范围内能保持较小的容值漂移，适用于一般工作温度波动环境。
- 良好的一般电气特性：适用于电源去耦、旁路和低频滤波等常规用途。
- 工艺兼容性：适配常见的 SMT 贴装与无铅回流焊流程，便于大规模生产。
四、典型应用场景
- PCB 电源旁路与去耦（微控制器、模拟前端、电源管理芯片等）
- 高频滤波与耦合回路（与其他电容并联以优化频率响应）
- 移动终端、可穿戴设备、工业控制与消费电子的小型化电路设计
五、布局与焊接建议
- 将电容尽量靠近被去耦芯片的电源引脚放置，缩短回路寄生电感。
- 对于电源网络建议并联不同容值的电容（例如与陶瓷低容值或钽电容配合），以覆盖更宽的频带。
- 采用制造商推荐的无铅回流曲线；避免超过推荐的最高峰值温度与保温时间，以减少裂纹和可靠性问题。
- 注意贴装过程中的机械应力，0402 尺寸对板弯曲和过度剪力较敏感，应优化 PCB 板形与回流固定策略。
六、使用注意事项与可靠性提示
- DC 偏压影响：X7R 等 II 类介质在施加直流电压时会出现一定的容值下降，具体下降曲线与厂方数据相关，关键设计应参考厂商 DC bias 曲线并留有裕量。
- 温度与老化：X7R 在长期使用中容值会随时间与温度发生小幅变化，敏感电路需做预留或用反馈校正。
- 质量与合规：常见为 RoHS 等环保要求合规产品，量产和关键应用时建议向供应商索取完整规格书与可靠性测试报告。
如需更详细的电气特性曲线（例如频率响应、等效串联电阻 ESR、等效串联电感 ESL、DC bias 曲线和推荐回流曲线），建议索取三星 CL05B153KB5VPNC 的原厂规格书以便在具体设计中校核与仿真。
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