Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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CL10A106KO8NQNC 是由三星电机公司(Samsung Electro-Mechanics)制造的一款多层陶瓷电容器(MLCC),属于其 CL 系列。该电容器采用表面贴装(SMD)技术,具有出色的电性能和可靠性,广泛应用于电子设备中的功率管理、滤波和耦合等关键功能。
CL10A106KO8NQNC 电容器的电容值为 10µF,能够在高频和高温环境下保持良好的稳定性。这种高性能的特性使得该电容器在各种电子设备中都能发挥重要的作用,特别是对于手机、平板电脑、笔记本电脑及其他小型电子产品尤为适用。由于其表面贴装的设计,它可以轻松集成到现代化的 PCB(印刷电路板)中,并且能够显著节省空间。
CL 系列的产品特别适用于对空间要求严格的应用。此外,X5R 作为温度系数类型,能够保证电容器在工作温度范围内保持相对稳定的电容值,尽管在高温和低温条件下,其电容值会有所变化,但这些变化通常在设计范围内,适合大多数通用应用。
该电容器的额定电压为 16V,这使得它适用于多种工业和消费类电子设备的电源管理以及去耦作用。通过减小电源噪声和提高信号完整性,有助于提升整个电路系统的性能和稳定性。
CL10A106KO8NQNC 的封装尺寸为 0603,转换为公制为 1.60mm x 0.80mm。这一小型化封装能够满足现代电子产品中对空间的严格要求,同时方便实现高密度的电路布局。更重要的是,0603 封装的电容器已成为行业标准,易于获取,并与绝大多数的电路板设计兼容。
三星电机在电子元件制造领域享有良好的声誉。CL10A106KO8NQNC 电容器符合严格的工业标准,保证了其长期稳定的性能。本产品经过高达 1000 次循环的可靠性测试相较于竞争者具有更高的寿命和稳定性,适合长时间且高频率的操作。
CL10A106KO8NQNC 电容器是一个理想的选择,客户可在注重设备性能、体积及可靠性的应用中考虑使用。其优越的电气特性、高温稳定性及短小的封装设计,使其成为现代电子设备中不可或缺的关键元件。无论是用于高频滤波、功率管理还是能量存储,该电容器都能提供出色的性能,帮助设计师实现他们的创新设计。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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