WMSIC Electronic Components

CL10A106KO8NQNC

ModelCL10A106KO8NQNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10A106KO8NQNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10A106KO8NQNC
Electronic Component
1
Electronic Component
10uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0264355824
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL10A106KO8NQNC 产品概述

概述

CL10A106KO8NQNC 是由三星电机公司(Samsung Electro-Mechanics)制造的一款多层陶瓷电容器(MLCC),属于其 CL 系列。该电容器采用表面贴装(SMD)技术,具有出色的电性能和可靠性,广泛应用于电子设备中的功率管理、滤波和耦合等关键功能。

主要参数

  • 制造商: Samsung Electro-Mechanics
  • 系列: CL
  • 零件状态: 有源
  • 容差: ±10%
  • 额定电压: 16V
  • 温度系数: X5R
  • 工作温度范围: -55°C 至 85°C
  • 安装类型: 表面贴装 (SMD)
  • 封装类型: 0603(1608公制)
  • 尺寸: 1.60mm x 0.80mm x 0.95mm
  • 电容: 10µF

功能与应用

CL10A106KO8NQNC 电容器的电容值为 10µF,能够在高频和高温环境下保持良好的稳定性。这种高性能的特性使得该电容器在各种电子设备中都能发挥重要的作用,特别是对于手机、平板电脑、笔记本电脑及其他小型电子产品尤为适用。由于其表面贴装的设计,它可以轻松集成到现代化的 PCB(印刷电路板)中,并且能够显著节省空间。

CL 系列的产品特别适用于对空间要求严格的应用。此外,X5R 作为温度系数类型,能够保证电容器在工作温度范围内保持相对稳定的电容值,尽管在高温和低温条件下,其电容值会有所变化,但这些变化通常在设计范围内,适合大多数通用应用。

该电容器的额定电压为 16V,这使得它适用于多种工业和消费类电子设备的电源管理以及去耦作用。通过减小电源噪声和提高信号完整性,有助于提升整个电路系统的性能和稳定性。

封装设计

CL10A106KO8NQNC 的封装尺寸为 0603,转换为公制为 1.60mm x 0.80mm。这一小型化封装能够满足现代电子产品中对空间的严格要求,同时方便实现高密度的电路布局。更重要的是,0603 封装的电容器已成为行业标准,易于获取,并与绝大多数的电路板设计兼容。

可靠性和质量

三星电机在电子元件制造领域享有良好的声誉。CL10A106KO8NQNC 电容器符合严格的工业标准,保证了其长期稳定的性能。本产品经过高达 1000 次循环的可靠性测试相较于竞争者具有更高的寿命和稳定性,适合长时间且高频率的操作。

结论

CL10A106KO8NQNC 电容器是一个理想的选择,客户可在注重设备性能、体积及可靠性的应用中考虑使用。其优越的电气特性、高温稳定性及短小的封装设计,使其成为现代电子设备中不可或缺的关键元件。无论是用于高频滤波、功率管理还是能量存储,该电容器都能提供出色的性能,帮助设计师实现他们的创新设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.