Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10A475KA8NQNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10A475KA8NQNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10A475KA8NQNC
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM0000001238
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SAMSUNG CL10A475KA8NQNC 贴片电容
一、基本信息
产品名称：CL10A475KA8NQNC
品牌：SAMSUNG（三星）
封装类型：0603
电容：4.7µF
额定电压：25V
容差：±10%
工作温度范围：-55°C ~ 85°C
厚度（最大值）：0.035"（0.90mm）
温度系数：X5R
尺寸：0.063" 长 x 0.031" 宽（1.60mm x 0.80mm）
安装类型：表面贴装（MLCC）
二、产品特色
SAMSUNG CL10A475KA8NQNC是一款高性能的多层陶瓷电容器（MLCC），其广泛应用于各种电子设备中。作为0603封装类型的贴片电容，它不仅体积小巧，而且在电气性能和稳定性方面表现出色，适合在空间要求严格的应用场景中使用。
2.1 高承受电压和电容量的结合
CL10A475KA8NQNC的额定电压为25V，与其4.7µF的电容值相结合，提供了极具竞争力的能量储存能力。即使在不同工作条件下，该系列电容器仍保持稳定性能，确保设备在高压环境下的安全运行。
2.2 优良的温度特性
该型号的温度系数为X5R，适用于宽温范围-55°C至85°C的工作环境，展现了出色的温度稳定性。这种特性使得CL10A475KA8NQNC电容器非常适合用于在温度波动频繁的电子应用中，例如汽车电子、消费电子和工业设备等。
2.3 容差与可靠性
CL10A475KA8NQNC的容差为±10%，在设计和实现电路性能时，提供了相对较高的精准度和可靠性。无论是用于电源滤波、耦合还是去耦合，这种电容都能有效减少电路中的噪声，提高整体表现。
三、应用场景
SAMSUNG CL10A475KA8NQNC电容器广泛应用于多个领域，具体包括但不限于：
- 消费电子：如智能手机、平板电脑和家用电器等，涉及电源管理模块的去耦和滤波。
- 汽车电子：在传感器、控制单元及车载信息娱乐系统中，用于稳定电源并滤除噪声，确保系统的高可靠性。
- 工业设备：工业控制系统中的信号处理和电源模块中，提高设备的稳定性和抗干扰能力。
- 通信设备：如路由器和交换机等，确保在高频率信号下的信号完整性和电源稳定性。
四、总结
总体而言，SAMSUNG CL10A475KA8NQNC是一款性能稳定、信号干扰抗性强的多层陶瓷电容器，适合多种应用场景。它不仅满足现代电子产品对高性能和小型化的需求，而且在温度和电压变化的挑战下，依然能够提供可靠的电气性能。无论是在设计新产品还是更新现有产品时，选择CL10A475KA8NQNC电容器可以为您的项目带来良好的性能保证和市场竞争力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
