WMSIC Electronic Components

CL10B224KB8VPNC

ModelCL10B224KB8VPNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10B224KB8VPNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B224KB8VPNC
Electronic Component
1
Electronic Component
220nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265916360
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL10B224KB8VPNC多层陶瓷贴片电容(MLCC)产品概述

三星CL10B224KB8VPNC是一款0603封装的高性能多层陶瓷贴片电容(MLCC),凭借稳定的电气性能、宽温适应性及小体积优势,广泛应用于消费电子、工业控制、通信等领域。以下从产品身份、核心参数、性能特性、应用场景等维度展开概述。

一、产品基本身份识别

CL10B224KB8VPNC属于三星电子MLCC产品线,型号编码隐含核心参数:

  • 容值代码:224 → 22×10⁴ pF = 220 nF;
  • 精度代码:K → ±10%;
  • 电压代码:B → 额定直流电压50 V;
  • 温度系数:X7R(型号中隐含材质特性);
  • 封装:0603(英制,对应公制1608,尺寸1.6 mm×0.8 mm)。

二、核心电气与物理参数

该电容的关键参数明确且稳定,满足多数中低功率电路需求:

参数项 具体值 标称容值 220 nF(224 pF) 容值精度 ±10%(K级) 额定直流电压 50 V 温度系数 X7R(-55℃ ~ +125℃,容变±15%) 封装尺寸(公制) 1.6 mm×0.8 mm×0.8 mm(典型) 损耗角正切值(1 kHz) 典型值0.015(最大0.02) 耐焊接温度 260℃(回流焊10秒无失效)

三、关键性能特性解析

  1. 宽温稳定性突出
    X7R材质的温度特性使其在-55℃至+125℃范围内,容值变化仅±15%,远优于Y5V等材质(容变可达-82%~+22%),适合极端环境下的工业、汽车电子应用。

  2. 小体积高密度集成
    0603封装体积仅为1.6×0.8mm,是小型化设备的理想选择——例如智能手机主板的电源滤波、可穿戴设备的信号耦合,能有效节省PCB空间。

  3. 高可靠性与抗干扰
    多层陶瓷结构无极性、无引线寄生电感,抗电磁干扰(EMI)能力强;三星成熟的制造工艺确保其在额定条件下寿命超10⁶小时,符合工业级可靠性标准。

  4. 低损耗适配信号处理
    1 kHz下损耗角正切值≤0.02,适合音频信号耦合、射频滤波等对损耗敏感的场景,避免信号衰减。

四、典型应用场景

  1. 消费电子领域
    智能手机、平板电脑、智能手表的电源滤波(Vcc到GND)、信号耦合(音频、射频模块),利用小体积实现高密度集成。

  2. 工业控制设备
    PLC(可编程逻辑控制器)的模拟量输入滤波、传感器信号调理电路,依赖X7R的宽温稳定性应对车间温差。

  3. 通信设备
    路由器、交换机的电源模块滤波、以太网接口信号滤波,提升设备抗干扰能力,保障数据传输稳定。

  4. 汽车电子辅助系统
    车载中控屏、倒车雷达的低功率电路滤波(需确认应用电压≤50V),适应车载-40℃~+85℃的环境温度。

五、选型与应用注意事项

  1. 电压降额使用
    实际工作电压建议不超过额定电压的80%(即40V),避免长期过应力导致容值衰减或失效。

  2. 温度范围匹配
    若应用环境温度超出-55℃+125℃,需更换为X8R(-55+150℃)等材质的电容。

  3. 焊接工艺规范
    采用回流焊时,温度曲线需符合三星MLCC焊接标准(峰值260℃,持续≤10秒),避免陶瓷层开裂。

  4. 存储条件
    未焊接的电容需存储在25℃±5℃、湿度≤60%的环境中,开封后建议1个月内使用完毕,防止受潮影响焊接性。

CL10B224KB8VPNC凭借均衡的性能与成本优势,成为中低端电子设备中电源滤波、信号耦合的主流选型之一,适合对体积、温度稳定性有要求的批量应用场景。

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