Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B103KB8NNNC 是一款高性能的多层陶瓷电容器 (MLCC),由著名品牌三星(SAMSUNG)生产。该产品特别设计用于表面贴装技术 (SMT),具有广泛的应用场景,适合各种电子设备和电路的需求。这款电容器的容值为10nF(10000pF),额定电压为50V,精度为±10%,并且采用了X7R介质材料,保证了在多种工作条件下的稳定性和可靠性。
精度与容值: CL10B103KB8NNNC 的容值为10nF(10000pF),具有±10% 的容差,使其在实际应用中具备良好的稳定性和可预测性。在高频应用或快速信号处理中,该电容能够有效地平衡信号的质量和传输的稳定性。
额定电压: 此型号的额定电压为50V,能够在相对高电压的环境中安全工作,适用于大多数电子电路,特别是主流消费类电子产品和工业控制电路。
温漂系数: X7R 即温度系数,适用于-55°C至125°C 的工作温度范围,确保在极端温度条件下能够保持性能稳定。这一特性使其适合用于汽车电子、航空航天和其他对温度敏感的应用场合。
安装类型与封装: CL10B103KB8NNNC 采用0603(1608公制)封装,这种表面贴装封装使其可在现代高速自动化生产中轻松安装,同时也有助于节省空间。这种紧凑的设计为各种小型化电子设备提供了先进的解决方案。
物理尺寸: 该电容器的尺寸为0.063"长×0.031"宽(1.60mm x 0.80mm),厚度最大为0.035"(0.90mm),便于在空间有限的电路板中使用。
CL10B103KB8NNNC 由于其出色的性能参数和封装设计,广泛适用于以下应用领域:
CL10B103KB8NNNC 是一款极具竞争力的多层陶瓷电容器,凭借其高可靠性、卓越的性能和广泛的应用场景,成为设计者和工程师在开发现代电子产品时优先选择的元器件之一。无论是在提升电路性能的去耦和滤波应用,还是在需求严苛的环境中进行稳定运行,CL10B103KB8NNNC 提供了一个可靠的解决方案。选择三星的这款电容器,无疑为您的设计增加了一层质量保障。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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