WMSIC Electronic Components

CL10B333KB8NNNC

ModelCL10B333KB8NNNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL10B333KB8NNNC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B333KB8NNNC
Electronic Component
1
Electronic Component
33nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0263343723
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL10B333KB8NNNC

基本信息

CL10B333KB8NNNC 是一款由三星(SAMSUNG)生产的表面贴装多层陶瓷电容器(MLCC)。其具有额定电压为50V、容量为0.033µF(33nF)等基本特性,适合在多种电子应用中广泛使用。该器件在厚度上控制在0.035英寸(0.90mm)以内,采用0603封装尺寸,便于在小型电子设备中实现高密度组装。

规格与参数

  • 容值: 0.033µF (33nF)
  • 电压限制: 50V
  • 耐温范围: -55°C ~ 125°C,保证在严苛环境下的稳定性与可靠性
  • 封装尺寸: 0603 (1.60mm x 0.80mm),宽度和长度均适于现今电子产品的微型化需求
  • 厚度: 最大0.035 inches (0.90mm)
  • 温度系数: X7R,表明此电容在较宽的温度范围内保持良好的电气性能
  • 容差: ±10%,提供适度的容差范围,适合多种精度要求的应用

电容器类型

作为MLCC(多层陶瓷电容器),CL10B333KB8NNNC通过多层陶瓷介质的叠加,实现高电容量与小型化的完美结合。与其他类型电容器相比,MLCC具有相对较低的损耗,在高频、高速应用中表现出色。MLCC非常适合在低至高多种频率下的高效工作,确保稳压和去噪。

应用领域

CL10B333KB8NNNC广泛应用于如下领域:

  1. 消费电子: 由于其小型化设计和稳定的性能,适合应用在手机、平板电脑、智能手表等消费类电子产品中。

  2. 通信设备: 为了实现信号去耦和滤波,CL10B333KB8NNNC在无线通信设备(如基站、路由器等)中也大有作为。

  3. 工业设备: 在各种工业机器设备中,电容器可用于电源管理与能量存储,提高使用的安全性和效率。

  4. 汽车电子: 对于电动汽车和自动驾驶系统中对电容器的稳定性要求极高,CL10B333KB8NNNC同样能够发挥其优势。

稳健的温度性能

CL10B333KB8NNNC的工作温度范围为-55°C至125°C,这一特点保证了其在多种环境下的适应能力。在高温或者极低温的工作条件下,依然可以保持较好的性能,适合用于军工和航天等对温度敏感的应用场合。

总结

作为一款多功能且高性能的电容器,CL10B333KB8NNNC无疑是现代电子设计中不可或缺的元件之一。它结合了良好的电气特性、稳定的温度性能以及适用于多种应用领域的灵活性,成为设计工程师所青睐的选择。无论是在信号处理、能量存储,还是在温度控制等多种场景下,这款电容器都表现出色,为电子产品的整体性能提升提供了必要的保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.